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TIG052TS-TL-E

Onsemi

TIG052TS-TL-E by Onsemi

TIG052TS-TL-E by Onsemi is an N-CHANNEL IGBT suitable for surface mount applications. With a max operating temp of 150 °C, it offers a Vce of 400V and Vge of 6V. Ideal for power electronics in various industries due to its high voltage capabilities and compact design.

Median Price

$1.359

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 686,431 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

686,431

-

$1.280

$1.150

$1.080

Verical

USA . 686,431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.350

686,431

-

-

$1.438

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 339 parts In-Stock

1+ parts

$1.358

100+ parts

-

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339

$1.358

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Vyrian

USA . 5,466 parts In-Stock

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5,466

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Distributors (Availability)

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Corphita

USA . 2,188 parts In-Stock

1+ parts

$1.287

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-

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2,188

$1.287

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Corohmni

South Africa . 68 parts In-Stock

1+ parts

$1.430

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-

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68

$1.430

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.303

100+ parts

$2.096

1k+ parts

$1.888

10k+ parts

-

1,000

$2.303

$2.096

$1.888

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AZTECH Wire

Italy . 980 parts In-Stock

1+ parts

$8.710

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980

$8.710

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Microchip USA

USA . 285 parts In-Stock

1+ parts

$8.905

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285

$8.905

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Continental Prestige Electronics

USA . 686,431 parts In-Stock

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100+ parts

$1.370

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686,431

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$1.370

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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SupplyDigital Components

Austria . 5,567 parts In-Stock

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5,567

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Kepictronics

USA . 5,048 parts In-Stock

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5,048

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Kulean Microsystems

USA . 3,705 parts In-Stock

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3,705

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Assy Fe

Spain . 2,548 parts In-Stock

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2,548

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TANS Electronics

Latvia . 2,191 parts In-Stock

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Problanco Electronics

Mexico . 1,766 parts In-Stock

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1,766

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UHIMA Technologies

Türkiye . 461 parts In-Stock

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461

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Overview

Unleash the power of technology with the TIG052TS-TL-E by Onsemi. Crafted with precision and expertise, this insulated gate bipolar transistor (IGBT) offers unparalleled performance in various applications. With its N-channel polarity and surface mount capability, this product stands out from the rest. Experience seamless operation at temperatures up to 150 °C and a maximum collector-emitter voltage of 400V. Elevate your projects with the reliability and efficiency of Onsemi's TIG052TS-TL-E, where quality meets innovation.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for high power applications.

Surface Mount: YES

Surface mount IGBTs are easy to install and remove, making them convenient for use in a variety of electronic devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures without compromising performance, ensuring reliable operation in demanding conditions.

Maximum Collector-Emitter Voltage: 400 V

The high maximum collector-emitter voltage of 400V allows this IGBT to handle high voltage applications with ease, enhancing its versatility.

Maximum Gate-Emitter Voltage: 6 V

The low maximum gate-emitter voltage of 6V reduces power consumption and heat dissipation, contributing to the efficiency of the device.

Maximum Gate-Emitter Threshold Voltage: 1 V

The low gate-emitter threshold voltage of 1V enables precise control over the switching characteristics of the IGBT, enhancing overall performance.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and reliability, ensuring a strong and durable connection in the circuit.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TIG052TS-TL-E attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

400 V

Maximum Gate-Emitter Threshold Voltage:

1 V

Maximum Gate-Emitter Voltage:

6 V

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

TIG052TS-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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