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TIG066SS-TL-E

Onsemi

TIG066SS-TL-E by Onsemi

TIG066SS-TL-E by Onsemi is an N-CHANNEL IGBT with 400V max collector-emitter voltage, 6V max gate-emitter voltage, and 150 °C max operating temperature. It is surface mountable and has a tin/bismuth terminal finish. Ideal for power electronics applications requiring high-voltage switching capabilities.

Median Price

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Lifecycle Status

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5

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1k+

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Chip Stock

USA . 31,450 parts In-Stock

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Cyclops Electronics Ltd

UK . 27,950 parts In-Stock

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Vyrian

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Digiode

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Flip Electronics

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AZTECH Wire

Italy . 1,220 parts In-Stock

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Component Stockers USA

USA . 457 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,057 parts In-Stock

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 13,000 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Corphita

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UHIMA Technologies

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Overview

Unleash the power of innovation with the TIG066SS-TL-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor offers superior performance and reliability, making it ideal for a wide range of applications. From industrial machinery to renewable energy systems, the TIG066SS-TL-E provides unmatched efficiency and precision. Upgrade your technology today with Onsemi's cutting-edge IGBT technology and experience the difference for yourself.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses and higher current carrying capability compared to P-CHANNEL IGBTs, making them more efficient for high power applications.

Surface Mount: YES

Surface mount IGBTs are easier to install and replace, saving time and effort in manufacturing or maintenance processes.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can handle harsh environmental conditions and heavy load requirements without overheating.

Maximum Collector-Emitter Voltage: 400 V

The high voltage rating of 400V allows this IGBT to be used in a wide range of applications, including power supplies, motor control, and renewable energy systems.

Maximum Gate-Emitter Voltage: 6 V

The low gate-emitter voltage of 6V ensures efficient switching and control of the IGBT, improving overall performance and reliability.

Maximum Gate-Emitter Threshold Voltage: 1 V

The low gate-emitter threshold voltage of 1V enables precise control of the IGBT's switching characteristics, reducing power losses and improving efficiency.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and heat resistance, ensuring a reliable connection and stable performance in various operating conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TIG066SS-TL-E attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

400 V

Maximum Gate-Emitter Threshold Voltage:

1 V

Maximum Gate-Emitter Voltage:

6 V

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

TIG066SS-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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