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TIG062E8

Onsemi

TIG062E8 by Onsemi

The Onsemi TIG062E8 is an N-CHANNEL IGBT with a max collector-emitter voltage of 400V and operating temp of 150 °C. Suitable for surface mount applications, it has a gate-emitter threshold voltage of 0.9V. Ideal for power electronics in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Vyrian

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Digiode

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SupplyDigital Components

Austria . 6,551 parts In-Stock

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Kulean Microsystems

USA . 6,085 parts In-Stock

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Corphita

USA . 2,440 parts In-Stock

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UHIMA Technologies

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Problanco Electronics

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Corohmni

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TANS Electronics

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Overview

Unleash the power of innovation with the TIG062E8 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Designed for efficiency and reliability, this N-CHANNEL transistor is ideal for a wide range of applications. From industrial machinery to renewable energy systems, the TIG062E8 offers unmatched performance and durability. Experience seamless integration and superior functionality with Onsemi's cutting-edge technology. Elevate your projects with the TIG062E8 and unlock endless possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower ON-state voltage drop and higher switching speed compared to P-CHANNEL IGBTs, making them a better choice for many applications.

Surface Mount: YES

Surface mount IGBTs are easy to install and provide a compact solution, making them suitable for applications where space is limited.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this IGBT can be used in high-temperature environments without fear of overheating or performance degradation.

Maximum Collector-Emitter Voltage: 400 V

The high maximum collector-emitter voltage of 400V ensures that this IGBT can handle higher voltage levels, making it suitable for a wide range of applications.

Maximum Gate-Emitter Voltage: 6 V

The low maximum gate-emitter voltage of 6V reduces the risk of gate oxide breakdown and improves the reliability of the IGBT in high-power applications.

Maximum Gate-Emitter Threshold Voltage: 0.9 V

The low gate-emitter threshold voltage of 0.9V ensures that the IGBT can be easily turned on and off with minimal gate drive power, improving overall efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TIG062E8 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

400 V

Maximum Gate-Emitter Threshold Voltage:

.9 V

Maximum Gate-Emitter Voltage:

6 V

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Trade Compliance

TIG062E8 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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