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TIG056BF

Onsemi

TIG056BF by Onsemi

TIG056BF by Onsemi is an N-CHANNEL IGBT with 400V max collector-emitter voltage and 30W power dissipation. Ideal for power control applications, it features a single configuration with built-in diode and a turn-off time of 410ns. The transistor operates at up to 150 °C and has a gate-emitter threshold voltage of 5V.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 2,037 parts In-Stock

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Digiode

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SupplyDigital Components

Austria . 6,969 parts In-Stock

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TANS Electronics

Latvia . 2,482 parts In-Stock

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Problanco Electronics

Mexico . 993 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 569 parts In-Stock

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Kulean Microsystems

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Corohmni

South Africa . 254 parts In-Stock

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Overview

Unleash the power of your applications with the TIG056BF by Onsemi, a high-quality Insulated Gate Bipolar Transistor (IGBT) that delivers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this N-CHANNEL transistor offers single configuration with a built-in diode for efficient power control. Ideal for a wide range of applications, this IGBT is designed to maximize power dissipation while maintaining a low operating temperature. Experience the value and benefits of the TIG056BF, from its fast turn-off and turn-on times to its high collector-emitter voltage and exceptional gate-emitter threshold voltage. Upgrade your power control systems today with the TIG056BF by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs have lower conduction losses and are more efficient, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and improves efficiency by allowing for freewheeling current paths.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and reliability in such scenarios.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various electronic systems.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, making it suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 400 V

Can handle high voltage levels, enabling it to be used in demanding power electronics applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TIG056BF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

400 V

Maximum Gate-Emitter Threshold Voltage:

5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

410 ns

Nominal Turn On Time (ton):

78 ns

Trade Compliance

TIG056BF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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