Loading...

TIG064E8

Onsemi

TIG064E8 by Onsemi

The Onsemi TIG064E8 is an N-CHANNEL IGBT with a max operating temp of 150 °C. It features a max Vce of 400V and Vge of 4V, making it suitable for high-power applications like motor drives and inverters. With surface mount capability, it offers efficient power control in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,347

-

-

-

-

Vyrian

USA . 1,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,151

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,077

-

-

-

-

Kulean Microsystems

USA . 4,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,047

-

-

-

-

Problanco Electronics

Mexico . 3,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,785

-

-

-

-

TANS Electronics

Latvia . 1,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,004

-

-

-

-

Corphita

USA . 779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

779

-

-

-

-

UHIMA Technologies

Türkiye . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

269

-

-

-

-

Corohmni

South Africa . 72 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72

-

-

-

-

Overview

Experience superior performance and reliability with the TIG064E8 by Onsemi, a leading manufacturer in the industry. This insulated gate bipolar transistor (IGBT) offers unmatched quality and efficiency for various applications. With a maximum operating temperature of 150 °C and a collector-emitter voltage of 400V, this N-channel device is designed to meet your high-power needs while maintaining optimal performance. Trust Onsemi's expertise and elevate your projects with the TIG064E8, delivering value and benefits that exceed expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high switching speed, making them ideal for applications requiring efficient power control.

Surface Mount: YES

Surface mount IGBTs are compact and can be easily mounted on PCBs, saving space and simplifying assembly in electronic devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can handle demanding applications without overheating, ensuring reliability and longevity.

Maximum Collector-Emitter Voltage: 400 V

The high maximum collector-emitter voltage rating allows this IGBT to handle high voltage levels, making it suitable for power electronics applications.

Maximum Gate-Emitter Voltage: 4 V

The low gate-emitter voltage rating enables efficient gate control, leading to faster switching speeds and better performance in power switching applications.

Maximum Gate-Emitter Threshold Voltage: 0.9 V

The low gate-emitter threshold voltage ensures the IGBT can be turned on easily with minimal input power, contributing to energy efficiency and reduced heat generation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TIG064E8 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector-Emitter Voltage:

400 V

Maximum Gate-Emitter Threshold Voltage:

.9 V

Maximum Gate-Emitter Voltage:

4 V

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Trade Compliance

TIG064E8 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20