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SFT1423(TP)

Onsemi

SFT1423(TP) by Onsemi

SFT1423(TP) by Onsemi is a N-CHANNEL Power FET with 2A ID and 20W power dissipation. Ideal for applications requiring high drain current and low power consumption, such as power management systems in automotive electronics or industrial automation equipment.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,916 parts In-Stock

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1,916

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Digiode

USA . 495 parts In-Stock

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495

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Problanco Electronics

Mexico . 5,557 parts In-Stock

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5,557

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SupplyDigital Components

Austria . 5,463 parts In-Stock

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Kulean Microsystems

USA . 2,599 parts In-Stock

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2,599

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Corphita

USA . 1,691 parts In-Stock

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1,691

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UHIMA Technologies

Türkiye . 528 parts In-Stock

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528

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TANS Electronics

Latvia . 395 parts In-Stock

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395

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Corohmni

South Africa . 190 parts In-Stock

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Overview

Discover the power and efficiency of the SFT1423(TP) by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their Power Field Effect Transistors. Ideal for various applications, this N-CHANNEL FET offers enhanced performance and maximum power dissipation of 20W. With its METAL-OXIDE SEMICONDUCTOR technology and an operating temperature of up to 150 °C, the SFT1423(TP) guarantees optimal functionality and durability. Upgrade your devices with the exceptional value and benefits that this transistor provides, delivering superior results for all your power needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower ON resistance and higher switching speeds compared to P-CHANNEL FETs, making them more efficient for many applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and control compared to dual configuration FETs, making them ideal for straightforward applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and operate as they require a positive voltage at the gate to turn on, making them a good choice for various circuit designs.

Maximum Drain Current (Abs) (ID): 2 A

With a maximum drain current of 2 A, this FET can handle relatively high current loads, making it suitable for applications requiring moderate power levels.

Maximum Power Dissipation (Abs): 20 W

With a maximum power dissipation of 20 W, this FET can handle heat dissipation efficiently, allowing it to operate reliably under high-power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good noise performance, low power consumption, and high input impedance, making them suitable for various electronic applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments, ensuring reliable performance in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) SFT1423(TP) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

SFT1423(TP) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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