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SFT1423(TP-FA)

Onsemi

SFT1423(TP-FA) by Onsemi

SFT1423(TP-FA) by Onsemi is a N-CHANNEL FET with 2A ID and 20W power dissipation. It operates in enhancement mode, suitable for applications requiring high drain current up to 150 °C. Ideal for surface mount designs needing efficient power management in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,360 parts In-Stock

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2,360

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Vyrian

USA . 509 parts In-Stock

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509

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Problanco Electronics

Mexico . 6,968 parts In-Stock

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6,968

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Kulean Microsystems

USA . 3,280 parts In-Stock

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3,280

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Corphita

USA . 2,260 parts In-Stock

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2,260

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SupplyDigital Components

Austria . 1,455 parts In-Stock

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1,455

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TANS Electronics

Latvia . 756 parts In-Stock

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756

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Corohmni

South Africa . 311 parts In-Stock

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UHIMA Technologies

Türkiye . 88 parts In-Stock

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Overview

Unleash the power of innovation with the SFT1423(TP-FA) N-CHANNEL Power Field Effect Transistor by Onsemi. Designed for optimum performance and reliability, this single-channel FET is a game-changer in the world of semiconductor technology. From enhancing power efficiency in industrial automation to improving battery management systems in electric vehicles, this cutting-edge component offers unmatched value and versatility. Trust Onsemi's commitment to excellence and revolutionize your next project with the SFT1423(TP-FA).

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them a good choice for high performance applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and control compared to multiple configurations, making them ideal for basic circuit designs.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, making the product suitable for applications where space is limited.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require less power to operate and have faster switching speeds, making them ideal for high frequency applications.

Maximum Drain Current (Abs) (ID): 2 A

With a maximum drain current of 2 A, this FET can handle moderate power loads and is suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 20 W

The high maximum power dissipation of 20 W allows the FET to handle high power levels without overheating, ensuring reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance characteristics such as low gate leakage and high input impedance, making them a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperature environments, ensuring stable performance in challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) SFT1423(TP-FA) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

SFT1423(TP-FA) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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