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SFT1440-TL-H

Onsemi

SFT1440-TL-H by Onsemi

The Onsemi SFT1440-TL-H is a N-CHANNEL FET with 1.5A max drain current and 20W max power dissipation. Ideal for applications requiring high efficiency in power management circuits, it operates in enhancement mode at up to 150 °C, making it suitable for various surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,060 parts In-Stock

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Digiode

USA . 1,718 parts In-Stock

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1,718

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Kulean Microsystems

USA . 8,261 parts In-Stock

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8,261

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Problanco Electronics

Mexico . 7,304 parts In-Stock

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SupplyDigital Components

Austria . 6,791 parts In-Stock

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TANS Electronics

Latvia . 6,068 parts In-Stock

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Corphita

USA . 913 parts In-Stock

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UHIMA Technologies

Türkiye . 613 parts In-Stock

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Unlock the power of innovation with the SFT1440-TL-H by Onsemi. As a leader in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are versatile and reliable. Ideal for a wide range of applications, this N-CHANNEL transistor offers enhanced performance and efficiency. With a maximum power dissipation of 20W and Tin/Bismuth terminal finish, this product provides exceptional value to customers seeking high-quality components for their projects. Experience the benefits of superior technology and reliability with the SFT1440-TL-H from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have better performance characteristics compared to P-CHANNEL transistors, making this product a good choice for various applications.

Configuration: SINGLE

Single configuration makes it easier to integrate this transistor into circuits, simplifying the overall design and reducing complexities.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and improving overall system reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the transistor's behavior, enabling precise adjustment and optimization in different applications.

Maximum Drain Current (Abs): 1.5 A

High maximum drain current rating ensures that the transistor can handle a significant amount of current, making it suitable for power applications.

Maximum Power Dissipation (Abs): 20 W

High power dissipation capability allows the transistor to handle heat effectively, ensuring reliable operation even in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers excellent performance characteristics, such as low power consumption and high efficiency, making this product a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating ensures that the transistor can operate reliably even in elevated temperature environments, improving overall robustness.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and reliability, ensuring a secure connection in the circuit and enhancing the overall durability of the product.

Technical Specifications

Power Field Effect Transistors (FET) SFT1440-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

SFT1440-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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