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SFT1431-E

Onsemi

SFT1431-E by Onsemi

The Onsemi SFT1431-E is a N-CHANNEL FET with 11A ID and 15W power dissipation. Ideal for applications requiring high drain current and low power consumption, such as power management systems. Operating in enhancement mode, it offers reliable performance up to 150 °C with TIN BISMUTH terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 915 parts In-Stock

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Digiode

USA . 483 parts In-Stock

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Kulean Microsystems

USA . 6,446 parts In-Stock

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Problanco Electronics

Mexico . 5,516 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,334 parts In-Stock

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SupplyDigital Components

Austria . 3,429 parts In-Stock

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Corphita

USA . 2,046 parts In-Stock

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Corohmni

South Africa . 492 parts In-Stock

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UHIMA Technologies

Türkiye . 139 parts In-Stock

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Overview

Boost your power management capabilities with the SFT1431-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. The SFT1431-E falls under the Power Field Effect Transistors category, offering N-Channel configuration and Enhancement Mode operation. With a maximum drain current of 11A and power dissipation of 15W, this transistor is perfect for a wide range of applications. Experience improved efficiency and performance with the SFT1431-E, backed by Onsemi's reputation for excellence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high current-carrying capability and low ON-resistance, making them suitable for high-power applications.

Configuration: SINGLE

Single configuration FETs simplify circuit design and offer ease of use compared to multiple configurations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage to turn on, providing better control over power flow in the circuit.

Maximum Drain Current (ID): 11 A

With a high maximum drain current, this FET can handle significant power loads without risk of overheating or failure.

Maximum Power Dissipation: 15 W

The high maximum power dissipation capability allows this FET to handle high power levels without getting damaged, ensuring reliability in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET suitable for a wide range of power applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments without performance degradation, ensuring long-term reliability.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and corrosion resistance, ensuring secure connections and longevity in various operating environments.

Technical Specifications

Power Field Effect Transistors (FET) SFT1431-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN BISMUTH

Trade Compliance

SFT1431-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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