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SFT1440-H

Onsemi

SFT1440-H by Onsemi

The Onsemi SFT1440-H is a N-CHANNEL Power FET with 1.5A max drain current and 20W max power dissipation. Ideal for enhancement mode operation, it uses metal-oxide semiconductor technology. Commonly used in applications requiring high efficiency and temperature resistance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,492 parts In-Stock

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Digiode

USA . 1,731 parts In-Stock

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TANS Electronics

Latvia . 7,676 parts In-Stock

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Problanco Electronics

Mexico . 7,540 parts In-Stock

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SupplyDigital Components

Austria . 4,518 parts In-Stock

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Kulean Microsystems

USA . 3,503 parts In-Stock

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Corphita

USA . 1,451 parts In-Stock

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UHIMA Technologies

Türkiye . 332 parts In-Stock

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Corohmni

South Africa . 100 parts In-Stock

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Overview

Discover the power and efficiency of the SFT1440-H N-CHANNEL Power Field Effect Transistor by Onsemi. With a maximum drain current of 1.5A and a maximum power dissipation of 20W, this enhancement mode transistor offers reliable performance for a variety of applications. From automotive to industrial electronics, this single configuration FET provides the quality and reliability that Onsemi is known for. Upgrade your projects with the SFT1440-H and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and are suitable for basic applications, making this product a good choice for simple circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and switching speeds, making this product a good choice for applications requiring precise control and rapid switching.

Maximum Drain Current (Abs) (ID): 1.5 A

With a high maximum drain current, this FET can handle higher loads, making it a good choice for applications requiring high power output.

Maximum Power Dissipation (Abs): 20 W

With a high maximum power dissipation, this FET can handle higher power levels without overheating, making it a good choice for applications with high power requirements.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance and reliability, making this product a good choice for long-lasting applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in harsh environments without issues, making it a good choice for industrial applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish offers good solderability and is environmentally friendly, making this product a good choice for eco-conscious applications.

Technical Specifications

Power Field Effect Transistors (FET) SFT1440-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

SFT1440-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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