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SFT1405(TP-FA)

Onsemi

SFT1405(TP-FA) by Onsemi

Onsemi's SFT1405(TP-FA) is a N-CHANNEL FET with 10A ID and 15W power dissipation. Ideal for applications requiring high drain current, such as power management systems. Enhanced mode operation and surface mount configuration make it versatile for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,080 parts In-Stock

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1,080

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Digiode

USA . 510 parts In-Stock

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510

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TANS Electronics

Latvia . 8,360 parts In-Stock

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8,360

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Kulean Microsystems

USA . 3,405 parts In-Stock

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3,405

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SupplyDigital Components

Austria . 2,826 parts In-Stock

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2,826

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Corphita

USA . 1,179 parts In-Stock

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1,179

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UHIMA Technologies

Türkiye . 797 parts In-Stock

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797

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Corohmni

South Africa . 442 parts In-Stock

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442

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Problanco Electronics

Mexico . 295 parts In-Stock

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Overview

Experience the power of innovation with the SFT1405(TP-FA) by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and reliability. This N-CHANNEL transistor offers a single configuration, making it ideal for a wide range of applications. From enhancing efficiency to optimizing performance, this transistor is designed to meet your needs. Trust Onsemi to provide you with cutting-edge technology that maximizes power and efficiency, giving you the competitive edge in your projects. Elevate your designs with the SFT1405(TP-FA) and experience the difference today.

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-Channel FETs are known for their efficiency and reliability in switching applications, making this product a good choice for power control and amplification.

Configuration: SINGLE

The single configuration simplifies circuit design and offers ease of use, making it suitable for various electronic applications.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making this product ideal for applications where size is a consideration.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer faster switching speeds and lower power consumption, enhancing overall performance and efficiency of the device.

Maximum Drain Current (ID): 10 A

With a high maximum drain current, this FET can handle heavy loads with ease, making it suitable for high-power applications.

Maximum Power Dissipation: 15 W

The high power dissipation capability of 15W ensures reliable operation under heavy loads and prevents overheating, making this product durable and long-lasting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance and low output impedance, resulting in improved performance and reliability of the device.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures stable operation even in harsh environmental conditions, making this FET suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) SFT1405(TP-FA) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

SFT1405(TP-FA) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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