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SFT1440(TP)

Onsemi

SFT1440(TP) by Onsemi

SFT1440(TP) by Onsemi is a N-CHANNEL Power FET with 1.5A max drain current and 20W power dissipation. Ideal for enhancement mode operation, it uses metal-oxide semiconductor technology and can operate up to 150 °C. Suitable for various applications requiring high-power switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,643 parts In-Stock

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Digiode

USA . 1,255 parts In-Stock

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SupplyDigital Components

Austria . 7,307 parts In-Stock

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TANS Electronics

Latvia . 5,121 parts In-Stock

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Problanco Electronics

Mexico . 1,775 parts In-Stock

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Kulean Microsystems

USA . 1,051 parts In-Stock

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UHIMA Technologies

Türkiye . 871 parts In-Stock

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Corphita

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Corohmni

South Africa . 134 parts In-Stock

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Overview

Power up your projects with the SFT1440(TP) by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like no other. This N-CHANNEL transistor operates in ENHANCEMENT MODE and offers a maximum drain current of 1.5A and power dissipation of 20W. Whether you're designing power supplies, motor control circuits, or LED lighting applications, this FET provides reliable performance and efficiency. Elevate your designs with the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making them ideal for power applications.

Configuration: SINGLE

Single configuration FETs are easy to use and require less complexity in circuit design, making them user-friendly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over the flow of current, resulting in improved efficiency and performance.

Maximum Drain Current (ID): 1.5 A

With a high maximum drain current rating, this FET can handle higher power loads without overheating or damage.

Maximum Power Dissipation: 20 W

The high power dissipation capability of 20W ensures that this FET can handle high power applications without failure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs are known for their low on-state resistance, high input impedance, and fast switching speeds, making them suitable for power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can operate in harsh environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) SFT1440(TP) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

SFT1440(TP) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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