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SFT1403(TP-FA)

Onsemi

SFT1403(TP-FA) by Onsemi

SFT1403(TP-FA) by Onsemi is a N-CHANNEL Power FET with 14A max drain current and 20W power dissipation. Ideal for applications requiring high power efficiency in enhancement mode operation, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,890 parts In-Stock

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Vyrian

USA . 1,804 parts In-Stock

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Problanco Electronics

Mexico . 4,903 parts In-Stock

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SupplyDigital Components

Austria . 4,279 parts In-Stock

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TANS Electronics

Latvia . 3,231 parts In-Stock

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Corphita

USA . 1,422 parts In-Stock

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Corohmni

South Africa . 480 parts In-Stock

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480

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UHIMA Technologies

Türkiye . 262 parts In-Stock

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Kulean Microsystems

USA . 6 parts In-Stock

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Overview

Unlock the power of innovation with the SFT1403(TP-FA) by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed for efficiency and reliability. The N-CHANNEL configuration and Enhancement Mode operation ensure optimal performance in a variety of applications. With a maximum drain current of 14 A and a power dissipation of 20 W, this FET is a game-changer for any project requiring high-performance components. Elevate your designs with the SFT1403(TP-FA) and experience the value and benefits it brings to your applications.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower on-state resistance and higher efficiency compared to P-CHANNEL FETs, making them a better choice for many applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and require fewer components in the circuit, making them more cost-effective and easier to design with.

Surface Mount: YES

Surface mount FETs are more compact and can be directly mounted on the PCB, saving space and simplifying assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and typically have lower threshold voltages, making them more suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 14 A

With a high maximum drain current, this FET can handle high-power applications with ease, providing reliable performance under heavy loads.

Maximum Power Dissipation (Abs): 20 W

The high maximum power dissipation of 20W ensures that the FET can safely operate at high power levels without overheating or getting damaged.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low cost, and fast switching speeds, making it a popular choice for power FETs in many applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments without compromising performance, ensuring reliability in harsh conditions.

Technical Specifications

Power Field Effect Transistors (FET) SFT1403(TP-FA) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

SFT1403(TP-FA) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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