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SFT1405(TP)

Onsemi

SFT1405(TP) by Onsemi

SFT1405(TP) by Onsemi is a N-CHANNEL FET with 10A ID and 15W power dissipation. Ideal for applications requiring high drain current and low power consumption, such as power management systems. Operating in enhancement mode, it offers reliable performance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,249 parts In-Stock

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Vyrian

USA . 104 parts In-Stock

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TANS Electronics

Latvia . 6,731 parts In-Stock

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Problanco Electronics

Mexico . 5,513 parts In-Stock

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SupplyDigital Components

Austria . 3,696 parts In-Stock

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Kulean Microsystems

USA . 1,397 parts In-Stock

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Corphita

USA . 1,111 parts In-Stock

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UHIMA Technologies

Türkiye . 785 parts In-Stock

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Corohmni

South Africa . 76 parts In-Stock

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Overview

Unleash the power of innovation with the SFT1405(TP) by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). This N-CHANNEL transistor operates in enhancement mode, offering a maximum drain current of 10A and a power dissipation of 15W. Perfect for a wide range of applications, this METAL-OXIDE SEMICONDUCTOR technology ensures optimal performance at temperatures up to 150 °C. Experience the value and benefits that this product brings to your projects, from increased efficiency to enhanced functionality. Elevate your designs with the SFT1405(TP) by Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower ON resistance and higher efficiency compared to P-CHANNEL FETs, making them a good choice for high-power applications.

Configuration: SINGLE

Single configuration makes the FET easier to control and integrate into circuits, simplifying the overall design.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and can be easily turned on and off, providing precise control over power flow in the circuit.

Maximum Drain Current (Abs) (ID): 10 A

With a high maximum drain current, this FET can handle large amounts of current without overheating or failing, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 15 W

The high maximum power dissipation ensures that the FET can dissipate heat effectively, preventing overheating and ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good efficiency, performance, and reliability, making it a popular choice for power FETs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in harsh environments without reliability issues, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) SFT1405(TP) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

SFT1405(TP) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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