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NXH200T120H3Q2F2SG

Onsemi

NXH200T120H3Q2F2SG by Onsemi

NXH200T120H3Q2F2SG by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat and 256A IC. Ideal for POWER CONTROL applications, it has a tr of 102ns, tf of 99ns, and toff of 1096ns. This COMPLEX transistor operates b/w -40 °C to 150°C with a max power dissipation of 679W in a RECTANGULAR package style.

Median Price

$323.925

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 33 parts In-Stock

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$133.850

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$116.912

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Chip1Stop

Japan . 8 parts In-Stock

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$514.000

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EBV Elektronik

Germany . 432 parts In-Stock

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Digiode

USA . 1,406 parts In-Stock

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$193.562

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Vyrian

USA . 678 parts In-Stock

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$203.750

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NAC Semi

USA . 348 parts In-Stock

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$309.510

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$281.370

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348

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$281.370

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Distributors (Availability)

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Corphita

USA . 871 parts In-Stock

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$183.375

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871

$183.375

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Corohmni

South Africa . 480 parts In-Stock

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$203.750

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480

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Microchip USA

USA . 177 parts In-Stock

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$320.760

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QUARKTWIN TECHNOLOGY LTD

USA . 15,027 parts In-Stock

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Kulean Microsystems

USA . 5,591 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,173 parts In-Stock

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Problanco Electronics

Mexico . 1,759 parts In-Stock

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TANS Electronics

Latvia . 935 parts In-Stock

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UHIMA Technologies

Türkiye . 793 parts In-Stock

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Overview

Unleash the power of the NXH200T120H3Q2F2SG by Onsemi, a top-tier Insulated Gate Bipolar Transistor designed for high-performance power control applications. With Onsemi's reputation for excellence in manufacturing, this N-CHANNEL transistor offers unmatched quality and reliability. Experience faster rise and fall times, lower VCEsat, and higher power dissipation capabilities. Elevate your projects with the innovative features and superior performance of the NXH200T120H3Q2F2SG, setting new standards in the industry.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state resistance and faster switching speeds compared to P-channel IGBTs, making them more efficient for power control applications.

Maximum Rise Time (tr): 102 ns

The fast rise time of 102 ns allows for quick switching speeds, which is essential for power control applications that require precise timing and responsiveness.

Maximum VCEsat: 2.3 V

The low VCEsat of 2.3 V indicates minimal voltage drop across the collector-emitter junction when the IGBT is conducting, leading to lower power dissipation and increased efficiency.

Maximum Power Dissipation (Abs): 679 W

With a high maximum power dissipation of 679 W, this IGBT can handle high power loads without overheating, making it suitable for demanding power control applications.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating of 1200 V allows the IGBT to withstand high voltage levels, making it suitable for power control applications in industrial settings.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH200T120H3Q2F2SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

99 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X56

No. of Elements:

4

No. of Terminals:

56

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

102 ns

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1096 ns

Nominal Turn On Time (ton):

373 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NXH200T120H3Q2F2SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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