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NXH25T120L2Q1PTG

Onsemi

NXH25T120L2Q1PTG by Onsemi

NXH25T120L2Q1PTG by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 25A IC, and 81W power dissipation. Ideal for power control applications, it features a turn-off time of 551ns and operates b/w -40 to 150 °C.

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1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 1,006 parts In-Stock

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TANS Electronics

Latvia . 8,198 parts In-Stock

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SupplyDigital Components

Austria . 3,447 parts In-Stock

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Kulean Microsystems

USA . 2,841 parts In-Stock

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Problanco Electronics

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Corphita

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UHIMA Technologies

Türkiye . 879 parts In-Stock

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Corohmni

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Overview

Enhance your power control applications with the NXH25T120L2Q1PTG from Onsemi. As a leading manufacturer in insulated gate bipolar transistors (IGBT), Onsemi delivers top-quality products that guarantee reliability and performance. With its N-CHANNEL configuration and 1200V maximum collector-emitter voltage, this IGBT offers superior power dissipation capabilities. Ideal for a wide range of industrial applications, this complex transistor provides exceptional value and efficiency, making it the perfect choice for your power control needs. Experience the difference with Onsemi's NXH25T120L2Q1PTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: COMPLEX

The complex configuration allows for versatile use in a range of power control applications, offering more flexibility in design.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, especially in compact electronic designs.

Maximum VCEsat: 2.5 V

Low VCEsat results in minimal power loss and higher efficiency, making the IGBT a cost-effective choice for power control applications.

No. of Elements: 12

Having multiple elements allows for higher power handling capacity, making this IGBT suitable for demanding power control applications.

Nominal Turn Off Time (toff): 551 ns

Fast turn off time enhances the efficiency and performance of the IGBT in power control applications, reducing switching losses.

No. of Terminals: 44

Having numerous terminals provides more options for connection and integration in complex circuits, enhancing the versatility of this IGBT.

Maximum Power Dissipation (Abs): 81 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, ensuring reliable operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this IGBT can withstand high temperatures, making it suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating enables the IGBT to handle high voltage applications, ensuring safe and reliable performance.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements due to its high thermal conductivity and performance, ensuring the IGBT's reliability.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating of 20V ensures the IGBT's gate drive compatibility with different control circuits, enhancing its versatility.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IGBT can operate in extreme cold environments, making it suitable for a wide range of applications.

Maximum Collector Current (IC): 25 A

High collector current rating allows the IGBT to handle large current flows, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage of 6.5V ensures efficient switching and control of the IGBT, enhancing its performance in power control applications.

Terminal Position: UPPER

Having the terminals positioned at the top simplifies the installation and connection process, making it easier to integrate the IGBT into circuits.

Case Connection: ISOLATED

Isolated case connection enhances safety and reliability by preventing electrical interference and short circuits, making the IGBT suitable for high voltage applications.

Nominal Turn On Time (ton): 77 ns

Fast turn on time of 77ns ensures quick response and accurate control in power switching applications, enhancing the efficiency of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH25T120L2Q1PTG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X44

No. of Elements:

12

No. of Terminals:

44

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

551 ns

Nominal Turn On Time (ton):

77 ns

Maximum VCEsat:

2.5 V

Trade Compliance

NXH25T120L2Q1PTG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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