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NSBC124EDXV6T1

Onsemi

NSBC124EDXV6T1 by Onsemi

NSBC124EDXV6T1 by Onsemi is a NPN BJT with 2 elements, built-in resistor, and hFE of 60. It has a max VCE of 50V, IC of 0.1A, and Pdiss of 0.5W. Ideal for switching applications due to its small outline package and silicon material.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 34,000 parts In-Stock

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Vyrian

USA . 11,859 parts In-Stock

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Digiode

USA . 1,727 parts In-Stock

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AZTECH Wire

Italy . 697 parts In-Stock

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$19.370

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SupplyDigital Components

Austria . 4,740 parts In-Stock

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Kulean Microsystems

USA . 4,232 parts In-Stock

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TANS Electronics

Latvia . 3,241 parts In-Stock

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Problanco Electronics

Mexico . 2,280 parts In-Stock

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Corphita

USA . 641 parts In-Stock

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Corohmni

South Africa . 278 parts In-Stock

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UHIMA Technologies

Türkiye . 65 parts In-Stock

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Overview

Enhance your electrical projects with the NSBC124EDXV6T1 by Onsemi, a high-quality Small Signal Bipolar Junction Transistor perfect for switching applications. With Onsemi's reputation for reliability and innovation, you can trust this NPN transistor to deliver exceptional performance. The package's separate configuration with built-in resistors offers added convenience, while its small outline shape makes it easy to incorporate into your designs. Experience the benefits of this transistor's maximum power dissipation, collector-emitter voltage, and current capacity, providing value and efficiency for your projects. Elevate your electronics with the NSBC124EDXV6T1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are widely used in amplification and switching circuits, offering versatility in circuit design.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

Built-in resistor simplifies circuit design and provides added protection for the transistor.

Transistor Application: SWITCHING

Optimized for switching applications, making it efficient and reliable in controlling power flow.

Surface Mount: YES

Surface mount design allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy handling and mounting on PCBs.

No. of Elements: 2

Having 2 separate elements allows for more versatile circuit configurations and applications.

Maximum Power Dissipation (Abs): 0.5 W

Can handle high power dissipation, making it suitable for applications that require robust performance.

Minimum DC Current Gain (hFE): 60

High DC current gain ensures efficient current control and amplification in the circuit.

Maximum Collector-Emitter Voltage: 50 V

Can handle up to 50V, suitable for applications that require higher voltage switching capabilities.

Terminal Finish: TIN

Tin finish provides corrosion resistance and ensures good electrical contact for reliable performance.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) NSBC124EDXV6T1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

60

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSBC124EDXV6T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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