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NJVMJD32CT4G-VF01

Onsemi

NJVMJD32CT4G-VF01 by Onsemi

NJVMJD32CT4G-VF01 by Onsemi is a PNP power bipolar junction transistor (BJT) with a max collector-emitter voltage of 100V and a max collector current of 3A. It is commonly used as an amplifier in various applications due to its small outline package style, high transition frequency of 3MHz, and wide operating temperature range from -65°C to 150°C.

Median Price

$0.348

Lifecycle Status

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12

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1k+

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Adafruit Industries

USA . 450 parts In-Stock

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$0.444

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$0.422

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$0.422

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$0.444

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Verical

USA . 47,500 parts In-Stock

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$0.253

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$0.253

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Digiode

USA . 1,981 parts In-Stock

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$0.422

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$0.422

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Nova Conductors

Japan . 50 parts In-Stock

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$0.430

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50

$0.430

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Bristol Electronics

USA . 408 parts In-Stock

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$0.487

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$0.180

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$0.156

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Flip Electronics

USA . 606,805 parts In-Stock

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Chip Stock

USA . 67,400 parts In-Stock

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ComSIT Distribution GmbH

Germany . 28,421 parts In-Stock

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ComSIT USA

USA . 28,421 parts In-Stock

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Vyrian

USA . 12,936 parts In-Stock

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Sensible Micro Corp

USA . 643 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 499 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 31,449 parts In-Stock

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$0.190

100+ parts

$0.185

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$0.184

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31,449

$0.190

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Ampacity Inc.

Singapore . 31,356 parts In-Stock

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$0.190

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Corphita

USA . 1,317 parts In-Stock

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$0.400

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Corohmni

South Africa . 418 parts In-Stock

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$0.413

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Continental Prestige Electronics

USA . 5,942 parts In-Stock

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$0.430

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$0.421

5,942

$0.430

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$0.421

Argo Parts USA

USA . 4,083 parts In-Stock

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$0.430

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$0.417

4,083

$0.430

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$0.417

Advanced Electronics

New Zealand . 450 parts In-Stock

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$0.444

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$0.422

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$0.422

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450

$0.444

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$0.422

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Aztec Data Supply Inc.

USA . 4,456 parts In-Stock

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$1.717

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$1.717

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AZTECH Wire

Italy . 978 parts In-Stock

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$22.100

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Infinite Electronics LLP (Excess)

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Lixinc

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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Problanco Electronics

Mexico . 2,536 parts In-Stock

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SupplyDigital Components

Austria . 1,711 parts In-Stock

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iodParts Technologies Inc.

India . 1,680 parts In-Stock

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$0.384

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TANS Electronics

Latvia . 1,236 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.421

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$0.409

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$0.400

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$0.400

UHIMA Technologies

Türkiye . 781 parts In-Stock

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Overview

Discover the NJVMJD32CT4G-VF01 by Onsemi, a high-quality power bipolar junction transistor that offers incredible value and benefits to customers. Manufactured by Onsemi, a renowned industry leader, this transistor guarantees reliability and performance. With its PNP polarity and single configuration, it is perfect for amplifier applications. Its surface mount capability and small outline package make installation a breeze. Whether you need to amplify signals or enhance your electronic circuits, the NJVMJD32CT4G-VF01 is the ideal choice. Trust Onsemi's expertise and elevate your designs with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a cost-effective solution while offering good thermal characteristics for this power BJT.

Polarity or Channel Type: PNP

The PNP configuration of this transistor allows for efficient amplification of signals, making it suitable for various amplifier applications.

Configuration: SINGLE

With a single configuration, this power BJT eliminates the need for additional components, simplifying the design and reducing cost.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this power BJT ensures optimal performance and superior amplification capabilities.

Surface Mount: YES

Being surface mountable, this power BJT offers easy and convenient installation, particularly in compact electronic devices.

Package Shape: RECTANGULAR

The rectangular shape of the package simplifies the mounting process while allowing for efficient space utilization in PCB designs.

Terminal Form: GULL WING

The gull wing terminal form enhances the solder joint integrity, ensuring a reliable connection and improved thermal performance.

No. of Elements: 1

With a single element, this power BJT simplifies circuit design and reduces complexity, making it more user-friendly.

No. of Terminals: 2

Featuring only two terminals, this power BJT offers straightforward integration and connection ease.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact and space-saving circuit designs while maintaining excellent functionality.

Minimum DC Current Gain (hFE): 10

The minimum DC current gain of 10 ensures reliable and consistent amplification performance in various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this power BJT can withstand rigorous operating conditions without compromising its performance.

Maximum Collector-Emitter Voltage: 100 V

The high maximum collector-emitter voltage rating of 100 volts allows for versatile applications, providing ample voltage headroom.

Transistor Element Material: SILICON

Utilizing silicon as the transistor element material ensures high-performance characteristics, such as low leakage and excellent thermal conductivity.

Minimum Operating Temperature: -65 °C

Designed to operate in extreme temperatures, the minimum operating temperature of -65°C provides reliable functionality even in harsh environments.

Maximum Collector Current (IC): 3 A

With a maximum collector current of 3 amps, this power BJT can handle demanding applications that require high current amplification.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and durability while providing a reliable connection for long-term usage.

Terminal Position: SINGLE

Featuring a single terminal position, this power BJT ensures straightforward and hassle-free circuit connections.

Moisture Sensitivity Level (MSL): 1

Having a moisture sensitivity level of 1 indicates that this power BJT is safe from moisture-related issues during storage and assembly.

Case Connection: COLLECTOR

The case connection to the collector enhances thermal dissipation and improves overall device performance, allowing for reliable operation even in demanding conditions.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this power BJT guarantees proper solder reflow and prevents damage during the assembly process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures complete and reliable solder joint formation during the assembly process.

Reference Standard: AEC-Q101

Conforming to the AEC-Q101 reference standard signifies that this power BJT meets strict automotive industry requirements, ensuring high reliability and durability.

Nominal Transition Frequency (fT): 3 MHz

With a nominal transition frequency of 3 megahertz, this power BJT provides excellent high-frequency performance, making it suitable for applications that require fast switching speeds.

Technical Specifications

Power Bipolar Junction Transistors (BJT) NJVMJD32CT4G-VF01 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

3 A

Maximum Collector-Emitter Voltage:

100 V

Configuration:

Minimum DC Current Gain (hFE):

10

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

NJVMJD32CT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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