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NGD15N41CLT4G

Onsemi

NGD15N41CLT4G by Onsemi

NGD15N41CLT4G by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 440V and max gate-emitter voltage of 15V. It is designed for automotive ignition applications, featuring a built-in diode and resistor in a small outline package style. With a max power dissipation of 107W, it operates at temperatures up to 175 °C.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Digiode

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ACDS - Activité Composants Distribution Service

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Metaverse IC Inc.

Canada . 38,652 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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A-Z Elektronik GmbH

Germany . 4,752 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 3,314 parts In-Stock

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Kulean Microsystems

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Assy Fe

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Corphita

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UHIMA Technologies

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Corohmni

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Enhance the performance of your automotive ignition systems with the NGD15N41CLT4G by Onsemi. This Insulated Gate Bipolar Transistor (IGBT) offers superior quality and reliability, thanks to the precision engineering of Onsemi. With a built-in diode and resistor, this N-channel transistor provides seamless integration and efficiency in automotive applications. Experience the benefits of enhanced power dissipation, optimal rise and fall times, and a wide operating temperature range. Trust Onsemi for cutting-edge technology that delivers exceptional value and performance to meet your automotive ignition needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IGBT, making it suitable for automotive applications where robustness is required.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower conduction losses and faster switching times compared to P-Channel IGBTs, making this product more efficient for automotive ignition systems.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Having a built-in diode and resistor simplifies the circuit design and saves space on the PCB, making it easier to integrate into automotive ignition systems.

Transistor Application: AUTOMOTIVE IGNITION

This IGBT is specifically designed for automotive ignition systems, ensuring optimal performance and reliability in this application.

Maximum Power Dissipation (Abs): 107 W

With a high maximum power dissipation, this IGBT can handle high power levels without overheating, making it reliable for automotive ignition systems.

Maximum Collector-Emitter Voltage: 440 V

The high maximum collector-emitter voltage rating ensures that the IGBT can withstand the voltage spikes and fluctuations commonly encountered in automotive systems, increasing its durability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD15N41CLT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

440 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

15 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

15500 ns

Nominal Turn On Time (ton):

5700 ns

Trade Compliance

NGD15N41CLT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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