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NGD18N40CLB

Onsemi

NGD18N40CLB by Onsemi

NGD18N40CLB by Onsemi is an N-CHANNEL IGBT with 430V max collector-emitter voltage, 15A max collector current, and 115W max power dissipation. Ideal for automotive ignition applications due to built-in diode and resistor, it operates at up to 175 °C with a rise time of 7000ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,469 parts In-Stock

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Vyrian

USA . 54 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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SupplyDigital Components

Austria . 7,846 parts In-Stock

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TANS Electronics

Latvia . 7,053 parts In-Stock

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Problanco Electronics

Mexico . 5,655 parts In-Stock

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Kulean Microsystems

USA . 3,830 parts In-Stock

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UHIMA Technologies

Türkiye . 464 parts In-Stock

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Corphita

USA . 364 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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Overview

Enhance your automotive ignition systems with the NGD18N40CLB by Onsemi. Crafted with precision and expertise, this N-CHANNEL IGBT transistor offers unrivaled performance and reliability. Its built-in diode and resistor configuration ensure seamless operation, while the small outline package design allows for easy surface mounting. Whether you're upgrading existing systems or developing new projects, this transistor is a game-changer. Trust Onsemi's legacy of quality and innovation to deliver exceptional results every time. Elevate your automotive electronics with the NGD18N40CLB and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides a good balance of cost-effectiveness and durability for this IGBT.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and higher efficiency compared to P-CHANNEL types, making this product a good choice for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor help simplify circuit design and save space on the PCB, making this product efficient and compact.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition applications, providing reliable performance and durability in demanding environments.

Maximum Rise Time (tr): 7000 ns

The fast rise time ensures quick switching speeds, reducing power losses and improving efficiency.

Maximum Power Dissipation (Abs): 115 W

With a high power dissipation rating, this IGBT can handle higher loads and operate efficiently under heavy loads.

Maximum Collector Current (IC): 15 A

The high collector current rating allows for greater power handling capabilities, making this IGBT suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures reliable performance even in high-temperature environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD18N40CLB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

430 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

1.9 V

Maximum Gate-Emitter Voltage:

18 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

13000 ns

Nominal Turn On Time (ton):

5200 ns

Trade Compliance

NGD18N40CLB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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