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NGD18N40ACLBT4G

Onsemi

NGD18N40ACLBT4G by Onsemi

NGD18N40ACLBT4G by Onsemi is an N-CHANNEL IGBT with 430V VCE, 15A IC, and 115W power dissipation. Ideal for applications requiring high power switching in surface mount designs. Operating up to 175 °C, it offers fast rise/fall times of 7000ns/15000ns for efficient performance.

Median Price

$7.300

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,449 parts In-Stock

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$7.300

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Digiode

USA . 2,294 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 2,652 parts In-Stock

1+ parts

$4.890

100+ parts

$4.650

1k+ parts

$4.500

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2,652

$4.890

$4.650

$4.500

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Ampacity Inc.

Singapore . 626 parts In-Stock

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$5.050

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626

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RC Electronics

USA . 61,323 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Perfect Parts

USA . 12,208 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,632 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,114 parts In-Stock

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SupplyDigital Components

Austria . 5,932 parts In-Stock

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Problanco Electronics

Mexico . 5,277 parts In-Stock

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Kepictronics

USA . 4,550 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 2,580 parts In-Stock

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TANS Electronics

Latvia . 1,365 parts In-Stock

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Kulean Microsystems

USA . 1,120 parts In-Stock

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UHIMA Technologies

Türkiye . 678 parts In-Stock

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Futuretech Components

Singapore . 658 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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Corphita

USA . 309 parts In-Stock

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Overview

Unleash the power of innovation with the NGD18N40ACLBT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors that are designed for superior performance and reliability. Ideal for a wide range of applications, this N-CHANNEL IGBT offers customers exceptional value with its high power dissipation, maximum operating temperature, and collector-emitter voltage. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically offer better conductivity and efficiency compared to P-CHANNEL IGBTs, making this product a good choice for high-performance applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Rise Time (tr): 7000 ns

The fast rise time of 7000 ns ensures quick switching speeds, making this IGBT suitable for applications that require rapid response times.

Maximum Fall Time (tf): 15000 ns

With a fall time of 15000 ns, this IGBT can efficiently turn off and minimize power loss during switching transitions.

Maximum Power Dissipation (Abs): 115 W

High power dissipation capability of 115 W allows this IGBT to handle high-power applications without overheating or damage.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this IGBT can withstand high temperature environments, ensuring reliable performance.

Maximum Collector-Emitter Voltage: 430 V

The high collector-emitter voltage rating of 430 V enables this IGBT to handle high voltage applications with ease.

Maximum Gate-Emitter Voltage: 18 V

The gate-emitter voltage rating of 18 V ensures safe and reliable operation of the IGBT within specified voltage limits.

Maximum Collector Current (IC): 15 A

The high collector current rating of 15 A allows this IGBT to handle high current loads, making it suitable for power applications.

Maximum Gate-Emitter Threshold Voltage: 2.1 V

The gate-emitter threshold voltage of 2.1 V ensures proper switching of the IGBT, preventing unintended operation and damage.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the reliability and lifespan of the IGBT.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, preventing damage to the IGBT.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for effective soldering of the IGBT onto the PCB, ensuring strong and reliable connections.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD18N40ACLBT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

430 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

18 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NGD18N40ACLBT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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