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NGD18N45CLBT4G

Onsemi

NGD18N45CLBT4G by Onsemi

NGD18N45CLBT4G by Onsemi is an N-CHANNEL IGBT with built-in diode and resistor, ideal for automotive ignition applications. It has a max collector-emitter voltage of 500V, collector current of 18A, and power dissipation of 115W. This surface-mount transistor operates at a max temperature of 175 °C.

Median Price

$0.661

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 69 parts In-Stock

1+ parts

$0.556

100+ parts

$0.529

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69

$0.556

$0.529

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Chip1Stop

Japan . 69 parts In-Stock

1+ parts

$0.860

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$0.543

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69

$0.860

$0.543

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Rochester

USA . 360 parts In-Stock

1+ parts

-

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$0.766

1k+ parts

$0.636

10k+ parts

$0.567

360

-

$0.766

$0.636

$0.567

Verical

USA . 69 parts In-Stock

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$0.529

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69

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$0.529

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Distributors (In-Stock)

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Digiode

USA . 630 parts In-Stock

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$0.597

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Vyrian

USA . 5,729 parts In-Stock

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5,729

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ACDS - Activité Composants Distribution Service

France . 2,128 parts In-Stock

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Bristol Electronics

USA . 2,128 parts In-Stock

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Dan-Mar Components

USA . 2,128 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 142 parts In-Stock

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$0.450

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142

$0.450

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Semicontronic

India . 47 parts In-Stock

1+ parts

$0.450

100+ parts

$0.439

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$0.436

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47

$0.450

$0.439

$0.436

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Corohmni

South Africa . 147 parts In-Stock

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$0.529

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147

$0.529

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Corphita

USA . 1,434 parts In-Stock

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$0.565

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$0.565

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Component Stockers USA

USA . 642 parts In-Stock

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$0.650

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$0.610

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642

$0.650

$0.610

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Microchip USA

USA . 146 parts In-Stock

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$3.900

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146

$3.900

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Kepictronics

USA . 47,500 parts In-Stock

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Perfect Parts

USA . 23,976 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 7,779 parts In-Stock

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Kulean Microsystems

USA . 5,270 parts In-Stock

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TANS Electronics

Latvia . 4,997 parts In-Stock

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Problanco Electronics

Mexico . 4,806 parts In-Stock

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UHIMA Technologies

Türkiye . 663 parts In-Stock

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663

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Overview

Experience unparalleled performance and reliability with the NGD18N45CLBT4G from Onsemi, a leading manufacturer in the industry of Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor, designed for automotive ignition applications, comes in a convenient surface mount package, making installation a breeze. With a built-in diode and resistor, this transistor maximizes efficiency and minimizes power dissipation, ensuring optimal performance under high temperatures. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NGD18N45CLBT4G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and mechanical strength, increasing the durability and reliability of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower conduction losses and faster switching speeds than P-Channel IGBTs, making them ideal for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and reduce component count, resulting in cost savings and improved efficiency.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring reliable performance in high-voltage applications.

Maximum Rise Time (tr): 9000 ns

Fast rise time allows for quick turn-on of the IGBT, reducing switching losses and improving efficiency.

Maximum Fall Time (tf): 7000 ns

Fast fall time enables rapid turn-off of the IGBT, minimizing heat dissipation and enhancing overall performance.

Maximum Power Dissipation (Abs): 115 W

High power dissipation capability ensures the IGBT can handle substantial load currents without overheating.

Maximum Operating Temperature: 175 °C

Can operate at elevated temperatures without compromising performance, ideal for automotive applications where temperature fluctuations may occur.

Maximum Collector-Emitter Voltage: 500 V

Handles high voltage levels safely, making it suitable for a wide range of high-power applications.

Maximum Collector Current (IC): 18 A

Capable of carrying high current loads, ensuring reliable operation in demanding automotive ignition systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IGBT is sensitive to moisture but can be safely handled with proper precautions during storage and handling.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGD18N45CLBT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

500 V

Maximum Fall Time (tf):

7000 ns

Maximum Gate-Emitter Threshold Voltage:

1.9 V

Maximum Gate-Emitter Voltage:

18 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

9000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

5400 ns

Nominal Turn On Time (ton):

2920 ns

Trade Compliance

NGD18N45CLBT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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