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NB6LQ572MMNG

Onsemi

NB6LQ572MMNG by Onsemi

NB6LQ572MMNG clock driver by Onsemi features a 10 ns propagation delay at 2.5V, suitable for industrial applications. With differential mux input conditioning and 32 terminals in a square package, it offers 2 true outputs and operates up to 5000 MHz, making it ideal for high-speed signal processing.

Median Price

$7.195

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32 parts In-Stock

1+ parts

$8.020

100+ parts

$7.540

1k+ parts

$6.820

10k+ parts

-

32

$8.020

$7.540

$6.820

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DigiKey

USA . 370 parts In-Stock

1+ parts

-

100+ parts

$6.370

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370

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$6.370

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Flip Electronics (Authorized)

USA . 165 parts In-Stock

1+ parts

-

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165

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Distributors (In-Stock)

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Digiode

USA . 681 parts In-Stock

1+ parts

$7.619

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681

$7.619

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Vyrian

USA . 13,211 parts In-Stock

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13,211

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Flip Electronics

USA . 270 parts In-Stock

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270

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Distributors (Availability)

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Corohmni

South Africa . 90 parts In-Stock

1+ parts

$6.370

100+ parts

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90

$6.370

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Corphita

USA . 1,318 parts In-Stock

1+ parts

$7.218

100+ parts

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1,318

$7.218

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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TANS Electronics

Latvia . 5,944 parts In-Stock

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5,944

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Problanco Electronics

Mexico . 3,982 parts In-Stock

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3,982

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Kulean Microsystems

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 777 parts In-Stock

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777

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SupplyDigital Components

Austria . 475 parts In-Stock

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475

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Microchip USA

USA . 129 parts In-Stock

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129

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Overview

Enhance your clock driver and buffering needs with the NB6LQ572MMNG from Onsemi. With a reputation for high-quality products, Onsemi delivers reliable solutions for all your timing requirements. This versatile chip carrier boasts a fast propagation delay of just 10 ns, making it ideal for applications requiring precise synchronization. Whether you're in industrial automation or telecommunications, this square-shaped package offers exceptional performance with a nominal supply voltage of 2.5V. Trust Onsemi to provide innovative solutions that meet your demands and exceed your expectations.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures accurate and synchronized output signals, making this product suitable for applications requiring precise timing.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and simplifying assembly process.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning helps in reducing noise and improving signal integrity, making it ideal for high-speed data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Stable nominal supply voltage of 2.5V ensures consistent performance and compatibility with a wide range of electronic devices.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40 °C to 85°C ensures reliable operation in harsh environmental conditions.

Technical Specifications

Clock Drivers & Buffers NB6LQ572MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V

Family:

6L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

5000 MHz

Trade Compliance

NB6LQ572MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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