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NB6L16DR2

Onsemi

NB6L16DR2 by Onsemi

NB6L16DR2 clock driver by Onsemi features a propagation delay of 0.18 ns, operating temperature range of -40 to 85 °C, and ECL technology. Ideal for applications requiring differential input conditioning in industrial settings. Package style is small outline with 8 terminals and peak reflow temp of 235 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,916 parts In-Stock

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3,916

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Digiode

USA . 1,469 parts In-Stock

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1,469

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AZTECH Wire

Italy . 266 parts In-Stock

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$19.170

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Ampacity Inc.

Singapore . 1,633 parts In-Stock

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$54.000

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Kulean Microsystems

USA . 5,518 parts In-Stock

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Problanco Electronics

Mexico . 3,588 parts In-Stock

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SupplyDigital Components

Austria . 2,167 parts In-Stock

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TANS Electronics

Latvia . 808 parts In-Stock

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808

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Corphita

USA . 252 parts In-Stock

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Microchip USA

USA . 139 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB6L16DR2 clock driver and buffer from Onsemi. Known for their high-quality manufacturing, Onsemi delivers reliable products that meet the demands of various applications. This versatile clock driver is perfect for ensuring precise synchronization in industrial settings, offering a wide range of benefits such as reduced skew, improved signal integrity, and enhanced overall system performance. Upgrade your systems today with the NB6L16DR2 and experience the difference in quality and efficiency that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to physical damage, making this product suitable for long-term use.

Surface Mount: YES

The surface mount feature makes it easier to integrate this clock driver/buffer into circuit boards, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL

Differential input conditioning enhances noise immunity and signal integrity, leading to reliable performance in demanding applications.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is common in many electronic systems, ensuring compatibility and ease of integration with various devices.

Propagation Delay (tpd): 0.18 ns

The low propagation delay of 0.18ns ensures fast signal processing, making this clock driver/buffer suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high heat environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliable performance in a wide range of temperature conditions.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making this clock driver/buffer efficient and reliable.

Technical Specifications

Clock Drivers & Buffers NB6L16DR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NB6L16DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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