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NB100ELT23LMNR4G

Onsemi

NB100ELT23LMNR4G by Onsemi

NB100ELT23LMNR4G by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It features a max supply voltage of 3.6V and a max delay of 3.25ns. Ideal for industrial applications requiring PECL to TTL translation in compact spaces due to its small outline package style and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,167 parts In-Stock

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2,167

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Vyrian

USA . 1,975 parts In-Stock

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1,975

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,628 parts In-Stock

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7,628

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SupplyDigital Components

Austria . 7,498 parts In-Stock

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Problanco Electronics

Mexico . 7,396 parts In-Stock

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7,396

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TANS Electronics

Latvia . 6,743 parts In-Stock

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6,743

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Corphita

USA . 1,309 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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478

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UHIMA Technologies

Türkiye . 385 parts In-Stock

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Overview

Experience seamless voltage level translation with the NB100ELT23LMNR4G by Onsemi. Crafted with precision and quality by a renowned manufacturer, this device offers unparalleled performance in various applications. Whether you're in need of reliable signal conversion or efficient power management, this voltage level translator delivers exceptional value and benefits to meet your specific needs. Trust Onsemi for cutting-edge technology and innovation that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology makes installation easier and allows for compact design, saving space on the PCB.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of systems that operate within this voltage limit.

No. of Functions: 2

Having multiple functions in one device adds versatility and functionality to the product.

Package Shape: SQUARE

Square shape is space-efficient and helps in easy placement on the PCB.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with most modern electronics.

No. of Terminals: 8

Sufficient terminals for connection, ensuring easy integration into the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This compact package style saves space, allows for efficient heat dissipation, and enables a slim design.

Minimum Supply Voltage: 3 V

Provides a safe operating margin and ensures stable performance at the minimum voltage limit.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions, increasing the product's versatility.

Terminal Finish: TIN

Tin finish offers good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection options.

Maximum Seated Height: 1 mm

Low profile design aids in space-saving and facilitates PCB assembly.

Width: 2 mm

Narrow width contributes to a compact overall footprint of the product.

Output Polarity: TRUE

Accurate output polarity ensures correct signal translation, enhancing the product's performance.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures, making it suitable for automated assembly processes.

Length: 2 mm

Short length aids in space-saving and allows for efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable operation in harsh environments.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, ideal for demanding applications.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations.

Nominal Supply Voltage: 3.3 V

Operating at a standard voltage of 3.3V ensures compatibility with most modern electronics.

Maximum Delay: 3.25 ns

Low delay ensures fast signal translation, critical for high-speed applications.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density integration and precise connections.

Interface IC Type: PECL TO TTL TRANSLATOR

Specific interface IC type ensures accurate signal translation between PECL and TTL logic levels.

Technical Specifications

Voltage Level Translators NB100ELT23LMNR4G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NB100ELT23LMNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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