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NB100LVEP91MNR2

Onsemi

NB100LVEP91MNR2 by Onsemi

NB100LVEP91MNR2 by Onsemi is a voltage level translator with PECL to ECL interface. It operates b/w 2.375V to 3.8V, has a max delay of 0.65ns, and supports industrial temperature grade applications. This chip carrier package with very thin profile and quad terminal position is ideal for high-speed communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,879 parts In-Stock

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Digiode

USA . 1,362 parts In-Stock

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AZTECH Wire

Italy . 514 parts In-Stock

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$13.320

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Kulean Microsystems

USA . 7,894 parts In-Stock

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SupplyDigital Components

Austria . 7,189 parts In-Stock

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TANS Electronics

Latvia . 6,196 parts In-Stock

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Problanco Electronics

Mexico . 4,570 parts In-Stock

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Microchip USA

USA . 3,666 parts In-Stock

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UHIMA Technologies

Türkiye . 976 parts In-Stock

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Corphita

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Corohmni

South Africa . 182 parts In-Stock

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Overview

Unlock new possibilities with the NB100LVEP91MNR2 by Onsemi, a cutting-edge voltage level translator designed to deliver exceptional performance in a variety of applications. Manufactured by Onsemi, a renowned industry leader known for their superior quality and innovation, this product offers unmatched reliability and efficiency. Perfect for use in industrial settings, this voltage level translator boasts a wide temperature range and robust construction, making it the ideal choice for demanding environments. Experience seamless operation and enhanced functionality with the NB100LVEP91MNR2 - your key to success in the rapidly evolving world of technology.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy installation on a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.8 V

Can support a wide range of applications with higher voltage requirements.

Package Shape: SQUARE

Provides a compact form factor for efficient use of space on the PCB.

No. of Terminals: 24

Offers multiple connection points for versatile integration into circuit designs.

Minimum Supply Voltage: 2.375 V

Can operate at lower voltage levels, enhancing flexibility in application usage.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial environments where higher temperatures may be present.

Width: 4 mm

Compact width allows for efficient use of space on the PCB layout.

Output Polarity: COMPLEMENTARY

Supports complementary signal outputs, which can be useful in certain signal processing applications.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed, low-power operation.

Maximum Delay: 0.65 ns

Provides fast signal translation with minimal delay, ideal for time-critical applications.

Technical Specifications

Voltage Level Translators NB100LVEP91MNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE

Maximum Delay:

.65 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Nominal Negative Supply Voltage:

-2.5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

NB100LVEP91MNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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