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MC10H606FNG

Onsemi

MC10H606FNG by Onsemi

MC10H606FNG by Onsemi is a voltage level translator with 6 functions, operating at 4.75-5.25V. It has a max delay of 3.75ns and operates in temperatures from 0 to 85 °C. Ideal for TTL/CMOS to PECL translation applications due to its ECL technology and complementary output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,391 parts In-Stock

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Digiode

USA . 1,599 parts In-Stock

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1,599

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QUARKTWIN TECHNOLOGY LTD

USA . 29,798 parts In-Stock

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TANS Electronics

Latvia . 8,165 parts In-Stock

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Kulean Microsystems

USA . 5,620 parts In-Stock

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SupplyDigital Components

Austria . 4,678 parts In-Stock

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Problanco Electronics

Mexico . 3,204 parts In-Stock

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Corphita

USA . 1,205 parts In-Stock

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UHIMA Technologies

Türkiye . 870 parts In-Stock

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Corohmni

South Africa . 278 parts In-Stock

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Microchip USA

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Overview

Unlock a world of seamless voltage translation with the MC10H606FNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality voltage level translators that offer unmatched reliability and performance. Ideal for a wide range of applications, this product ensures smooth signal transitions and precise voltage matching, making it a must-have for electronic design engineers. Experience the value and benefits of superior quality with the MC10H606FNG, where precision meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of systems, providing flexibility in application.

No. of Functions: 6

Having 6 functions integrated into one component simplifies circuit design and reduces the number of components required.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power supplies, ensuring easy integration into existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, improving overall reliability.

Minimum Operating Temperature: 0 °C

The product can operate in a wide temperature range, making it suitable for a variety of applications in different environments.

Output Polarity: COMPLEMENTARY

The complementary output polarity allows for bidirectional signal translation, enhancing versatility in circuit design.

Technology: ECL

The use of ECL technology ensures high-speed operation and low power consumption, making it ideal for high-performance applications.

Nominal Supply Voltage: 5 V

Operating at the standard 5V supply voltage simplifies integration with other components and systems.

Technical Specifications

Voltage Level Translators MC10H606FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

DIFFERENTIAL PECL INPUT ALSO POSSIBLE

Maximum Delay:

3.75 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

REGISTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H606FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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