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MC14504BD

Onsemi

MC14504BD by Onsemi

MC14504BD by Onsemi is a voltage level translator with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 3-18 V and max delay of 550 ns. Ideal for TTL/CMOS to CMOS translation in military-grade applications.

Median Price

$0.625

Lifecycle Status

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23

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TEDSS.com

USA . 123 parts In-Stock

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Freelance Electronics

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Component Electronics Inc.

Canada . 76 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

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Goldney Electronics S.L.

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Prism Electronics

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Electronic Expediters

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NPI Materials, Inc.

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ACDS - Activité Composants Distribution Service

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LWI Electronics Inc

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Bristol Electronics

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North Shore Components

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Pegasus Components GmbH

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First Choice Components Inc.

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Odintec Ltd.

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EMSNET

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Mil-Aero Solutions, Inc.

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Whistler Technology

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ECAB

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LittleDiode

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Corohmni

South Africa . 358 parts In-Stock

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Benley Electronics

USA . 20 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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Corphita

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Metaverse IC Inc.

Canada . 442 parts In-Stock

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UHIMA Technologies

Türkiye . 437 parts In-Stock

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Perfect Parts

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Elevate your voltage level translation needs with the MC14504BD by Onsemi. Crafted with precision and quality, this voltage level translator offers seamless integration in a compact package. With its versatile applications across various industries, it provides a reliable solution for your electronics projects. Trust in Onsemi's reputation for excellence and innovation to deliver a product that exceeds expectations. Discover the value and benefits that the MC14504BD brings to your designs and elevate your technology to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and versatile material for packaging, ensuring long-term reliability in various environments.

Surface Mount: YES

Easy to install on PCBs, saving space and improving overall system design.

Maximum Supply Voltage: 18 V

Supports a wide range of input voltages, making it versatile for different applications.

No. of Functions: 6

Can handle multiple translation functions simultaneously, reducing the need for multiple components.

Package Shape: RECTANGULAR

Compact shape for efficient use of PCB layout space.

Power Supplies (V): 5/15

Supports multiple power supply voltages, accommodating diverse system requirements.

No. of Terminals: 16

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Low profile package style for space-constrained applications.

Minimum Supply Voltage: 3 V

Works with low voltage systems, increasing compatibility with different devices.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments or under heavy loads.

Minimum Operating Temperature: -55 °C

Operates effectively in cold temperatures, suitable for a wide range of operating conditions.

Terminal Finish: TIN LEAD

Provides a reliable and secure connection between the component and PCB.

Terminal Position: DUAL

Allows for flexibility in PCB layout and component placement.

Maximum Seated Height: 1.75 mm

Low profile design for compact integration within a system.

Width: 3.9 mm

Narrow width for efficient use of PCB space.

Output Polarity: TRUE

Ensures accurate translation of input signals, critical for proper system operation.

Peak Reflow Temperature °C: 235

Withstands high-temperature reflow process during assembly, ensuring component reliability.

Length: 9.9 mm

Compact length for space-efficient PCB design.

Temperature Grade: MILITARY

Meets stringent military standards for performance and reliability.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical strength and reliability.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for easy integration into existing systems.

Maximum Delay: 550 ns

Low delay time for fast signal translation, minimizing latency in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Specifically designed for translating between TTL/CMOS and CMOS interfaces, providing seamless integration in mixed signal systems.

Technical Specifications

Voltage Level Translators MC14504BD attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

550 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC14504BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-408-2928, 5962014082928

NIIN

014082928

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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