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MC10H350MEL

Onsemi

MC10H350MEL by Onsemi

MC10H350MEL by Onsemi is a voltage level translator with 4 functions, operating at 5V. It features PECL to TTL translation, 5ns delay, and 3-STATE output. Ideal for commercial applications requiring ECL technology in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,362 parts In-Stock

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Vyrian

USA . 1,485 parts In-Stock

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1,485

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QUARKTWIN TECHNOLOGY LTD

USA . 18,141 parts In-Stock

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Problanco Electronics

Mexico . 6,171 parts In-Stock

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Microchip USA

USA . 5,154 parts In-Stock

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SupplyDigital Components

Austria . 4,275 parts In-Stock

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TANS Electronics

Latvia . 3,294 parts In-Stock

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Kulean Microsystems

USA . 1,461 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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485

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Corphita

USA . 345 parts In-Stock

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UHIMA Technologies

Türkiye . 117 parts In-Stock

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Overview

Unlock seamless communication and maximize performance with the MC10H350MEL by Onsemi. Crafted with precision and reliability, this voltage level translator offers unparalleled quality for your applications. With Onsemi's reputation for excellence, you can trust that this product delivers superior results. Whether you're in need of PECL to TTL translation or seeking enhanced signal integrity, the MC10H350MEL provides value, efficiency, and convenience all in one package. Elevate your projects with the exceptional benefits and advantages that this innovative product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V ensures compatibility with a wide range of systems and applications.

No. of Functions: 4

Having 4 functions in one device allows for more efficient use of board space and simplifies the design of the overall system.

Power Supplies (V): 5

The standard power supply of 5 V makes the product compatible with many existing systems and eliminates the need for additional power conversion.

No. of Terminals: 16

With 16 terminals, the product offers flexibility in connectivity options and allows for multiple input/output configurations.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide greater control over the output signal, allowing for more versatile use in different applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures reliable performance even in low-temperature environments.

Maximum Seated Height: 2.05 mm

The low maximum seated height of 2.05 mm saves space on the circuit board and allows for more compact designs.

Technology: ECL

The ECL technology used in the product ensures high-speed operation and low power consumption, making it suitable for demanding applications.

Technical Specifications

Voltage Level Translators MC10H350MEL attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H350MEL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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