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MC10H424FNG

Onsemi

MC10H424FNG by Onsemi

MC10H424FNG by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max and 4.75V min. It has a delay of 2.3ns, suitable for TTL to ECL translation in commercial applications at temperatures ranging from 0 to 75 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,953 parts In-Stock

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1,953

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Digiode

USA . 451 parts In-Stock

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451

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Distributors (Availability)

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Benley Electronics

USA . 1 parts In-Stock

1+ parts

$1.500

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1

$1.500

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Problanco Electronics

Mexico . 3,153 parts In-Stock

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TANS Electronics

Latvia . 2,682 parts In-Stock

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2,682

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Kulean Microsystems

USA . 2,532 parts In-Stock

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SupplyDigital Components

Austria . 1,333 parts In-Stock

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Corphita

USA . 1,291 parts In-Stock

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1,291

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UHIMA Technologies

Türkiye . 732 parts In-Stock

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732

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Corohmni

South Africa . 70 parts In-Stock

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Overview

Elevate your voltage level translation game with the MC10H424FNG by Onsemi. Crafted with precision and expertise, this chip carrier package offers a seamless transition from TTL to ECL translator. Perfect for applications requiring high-speed data transmission, this versatile device boasts unparalleled quality and reliability. Say goodbye to compatibility issues and hello to effortless integration. Trust in Onsemi's legacy of excellence and experience the benefits of seamless voltage level translation with the MC10H424FNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

The surface mount option allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages, increasing its versatility.

No. of Functions: 4

Having 4 functions in a single device can streamline the design and reduce the need for multiple separate components, resulting in cost and space savings.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing layout and design.

Power Supplies (V): 5,-5.2

The dual power supplies of 5V and -5.2V provide flexibility in powering the device and compatibility with various systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and inputs/outputs, enabling complex signal translations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and suitable for high-density PCB designs, making it a good choice for space-constrained applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the product's efficiency.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature range allows for use in a wide range of environmental conditions without compromising performance.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics enable easy interfacing with different signal types and devices, enhancing compatibility.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making this product suitable for various applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable connections for optimal performance.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and routing of signals, simplifying the design and assembly process.

Maximum Seated Height: 4.57 mm

With a low maximum seated height, this product is suitable for slim and compact designs where space constraints are a concern.

Width: 8.965 mm

The specific width of 8.965mm is suitable for standard PCB layouts, ensuring compatibility and ease of integration.

Output Polarity: COMPLEMENTARY

Complementary output polarity enhances signal integrity and accuracy, making this product ideal for precision applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260 °C ensures reliability during the soldering process, minimizing the risk of damage.

Length: 8.965 mm

The specific length of 8.965mm is suitable for standard PCB layouts, ensuring compatibility and ease of integration.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade allows for operation in both standard and extended temperature ranges, making this product versatile in various environments.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this product suitable for applications requiring fast signal translation.

Terminal Form: J BEND

The J bend terminal form provides strong mechanical support and secure connections, ensuring long-term reliability in operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard voltage requirements in many electronic systems, enhancing the product's versatility.

Nominal Negative Supply Voltage: -5.2 V

The nominal negative supply voltage of -5.2V enables bidirectional signal translation and compatibility with systems requiring negative voltage levels.

Maximum Delay: 2.3 ns

With a low maximum delay of 2.3ns, this product offers fast signal translation and minimal signal distortion, making it suitable for high-speed applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for easy connections and routing on standard PCB layouts, simplifying the design and assembly process.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain product integrity.

Interface IC Type: TTL TO ECL TRANSLATOR

Designed specifically as a TTL to ECL translator, this product ensures accurate and efficient signal translation between different logic levels, making it suitable for mixed-logic systems.

Technical Specifications

Voltage Level Translators MC10H424FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.3 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H424FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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