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MC100EPT24MNR4G

Onsemi

MC100EPT24MNR4G by Onsemi

MC100EPT24MNR4G by Onsemi is a voltage level translator with ±3.3V power supplies, 8 terminals, and ECL technology. It operates b/w -40 to 85 °C, has a max delay of 0.8ns, and converts LVTTL/LVCMOS to LVECL signals. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$8.680

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 987 parts In-Stock

1+ parts

$10.260

100+ parts

$6.950

1k+ parts

$5.880

10k+ parts

-

987

$10.260

$6.950

$5.880

-

DigiKey

USA . 516 parts In-Stock

1+ parts

$10.260

100+ parts

$6.940

1k+ parts

$6.212

10k+ parts

-

516

$10.260

$6.940

$6.212

-

Rochester

USA . 23,800 parts In-Stock

1+ parts

-

100+ parts

$5.680

1k+ parts

$5.080

10k+ parts

$4.780

23,800

-

$5.680

$5.080

$4.780

Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Verical

USA . 11,800 parts In-Stock

1+ parts

-

100+ parts

$7.100

1k+ parts

$6.350

10k+ parts

$5.975

11,800

-

$7.100

$6.350

$5.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 79 parts In-Stock

1+ parts

$5.985

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$5.985

-

-

-

Flip Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Vyrian

USA . 2,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,619

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,847 parts In-Stock

1+ parts

$5.670

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

$5.670

-

-

-

Corohmni

South Africa . 270 parts In-Stock

1+ parts

$6.300

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$6.300

-

-

-

Microchip USA

USA . 3,245 parts In-Stock

1+ parts

$18.175

100+ parts

-

1k+ parts

-

10k+ parts

-

3,245

$18.175

-

-

-

Problanco Electronics

Mexico . 8,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,145

-

-

-

-

SupplyDigital Components

Austria . 6,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,048

-

-

-

-

Kulean Microsystems

USA . 3,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,693

-

-

-

-

TANS Electronics

Latvia . 409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

409

-

-

-

-

UHIMA Technologies

Türkiye . 302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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302

-

-

-

-

Overview

Unlock the full potential of your electronic designs with the MC100EPT24MNR4G voltage level translator by Onsemi. Crafted with precision and cutting-edge technology, this small outline, heat sink package offers seamless translation between LVTTL/LVCMOS to LVECL signals. With a wide operating temperature range and nickel gold palladium terminal finish, this industrial-grade device ensures reliable performance in any application. Elevate your projects with fast 0.8 ns maximum delay and complementary output polarity, providing unparalleled efficiency and accuracy. Trust Onsemi to deliver excellence in every detail, empowering you to create innovative solutions that stand out in the market.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on a PCB, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different applications.

Package Shape: SQUARE

A square package shape is often compact and efficient for space-saving on a PCB.

Power Supplies (V): +-3.3

Provides dual power supplies, ensuring stability and reliability in voltage translation.

No. of Terminals: 8

Offers sufficient terminals for connectivity and functionality in a circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and thin profile package style enhances heat dissipation and facilitates integration in compact designs.

Minimum Supply Voltage: 3 V

Ensure proper functionality even at lower supply voltages, improving compatibility in various systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Withstands extreme cold temperatures, making it suitable for use in a wide range of environments.

Terminal Finish: NICKEL GOLD PALLADIUM

Ensures good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design and connection options.

Maximum Seated Height: 1 mm

Low profile design saves space and facilitates integration in dense PCB layouts.

Width: 2 mm

Compact width enables placement in tight spaces on a PCB while maintaining connectivity.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies signal processing and interfacing in circuits.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during the assembly process.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, ensuring robust assembly.

Length: 2 mm

Compact length contributes to a space-saving design on a PCB.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring reliability in harsh operating conditions.

Technology: ECL

Utilizes ECL technology for high-speed and low-power consumption operation.

Terminal Form: NO LEAD

Lead-free terminal form compliant with environmental regulations and ensures compatibility with lead-free soldering processes.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable performance in various applications.

Nominal Negative Supply Voltage: -3.3 V

Provides a negative supply voltage to support bidirectional signal translations in the circuit.

Maximum Delay: 0.8 ns

Offers low delay for fast signal translation, crucial in high-speed applications.

Terminal Pitch: 0.5 mm

Fine pitch enables high-density mounting on a PCB, suitable for compact designs.

Interface IC Type: LVTTL/LVCMOS TO LVECL TRANSLATOR

Supports voltage level translation between different logic families, enhancing compatibility in mixed-signal systems.

Technical Specifications

Voltage Level Translators MC100EPT24MNR4G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.8 ns

JESD-30 Code:

S-XDSO-N8

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-3.3 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

MC100EPT24MNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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