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MC10H124MNTXG

Onsemi

MC10H124MNTXG by Onsemi

MC10H124MNTXG by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max and 4.75V min. It has a delay of 3.1ns, suitable for TTL to ECL translation in commercial applications with temp range of 0-75 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,108 parts In-Stock

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Digiode

USA . 203 parts In-Stock

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203

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Kulean Microsystems

USA . 7,405 parts In-Stock

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7,405

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Problanco Electronics

Mexico . 5,049 parts In-Stock

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TANS Electronics

Latvia . 4,662 parts In-Stock

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SupplyDigital Components

Austria . 2,166 parts In-Stock

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Corphita

USA . 846 parts In-Stock

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UHIMA Technologies

Türkiye . 462 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the MC10H124MNTXG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality voltage level translators that provide seamless integration and reliable performance. Ideal for a wide range of applications, this versatile product offers customers the value, benefits, and advantages they need to enhance their projects. Trust Onsemi to deliver innovative solutions that exceed expectations and elevate your designs to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 5.25 V

Ability to handle high supply voltages makes this product suitable for a wide range of applications.

No. of Functions: 4

Multiple functions in a single device offer flexibility and efficiency in circuit design.

Package Shape: SQUARE

Square package shape allows for easy placement and compact layout on the PCB.

No. of Bits: 2

2 bits provide the capability to translate between different voltage levels accurately.

Power Supplies (V): 5,-5.2

Support for dual power supplies enables versatile operation in various voltage environments.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals in the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

A variety of package styles cater to different application requirements and space constraints.

Minimum Supply Voltage: 4.75 V

Operational at low supply voltages, increasing the product's versatility.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures reliability in various working conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter configuration allows for easy interfacing with other components in the circuit.

Minimum Operating Temperature: 0 °C

Operational at low temperatures, making it suitable for a wide range of environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and routing of signals.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact and efficient PCB assembly.

Width: 3 mm

Narrow width enables close placement of components on the PCB, optimizing layout design.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies interfacing with other digital circuits.

Length: 3 mm

Compact length saves space on the PCB and enables dense circuit designs.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade allows for reliable operation in a wide temperature range.

Technology: ECL

ECL technology offers high-speed performance and low power consumption for efficient signal translation.

Terminal Form: NO LEAD

No-lead terminal form provides reliability and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

Nominal supply voltage compatibility ensures proper operation in standard voltage environments.

Nominal Negative Supply Voltage: -5.2 V

Nominal negative supply voltage support complements the positive supply voltage for balanced operation.

Maximum Delay: 3.1 ns

Low maximum delay ensures fast signal translation, essential for high-speed digital circuits.

Terminal Pitch: 0.5 mm

Close terminal pitch allows for compact design and efficient routing of signals on the PCB.

Interface IC Type: TTL TO ECL TRANSLATOR

Specific interface IC type for translating TTL to ECL signals provides seamless compatibility between different logic families.

Technical Specifications

Voltage Level Translators MC10H124MNTXG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.1 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

MC10H124MNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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