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MC100EPT622FAG

Onsemi

MC100EPT622FAG by Onsemi

MC100EPT622FAG by Onsemi is a voltage level translator with 10 functions, operating at 3.3V. It features a max delay of 0.875ns and interface IC type LVTTL/LVCMOS to LVECL translator. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$20.370

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$20.370

100+ parts

-

1k+ parts

$16.110

10k+ parts

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245

$20.370

-

$16.110

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DigiKey

USA . 246 parts In-Stock

1+ parts

$26.610

100+ parts

$18.711

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-

10k+ parts

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246

$26.610

$18.711

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Chip1Stop

Japan . 101 parts In-Stock

1+ parts

$81.700

100+ parts

$38.300

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-

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101

$81.700

$38.300

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Rochester

USA . 9,951 parts In-Stock

1+ parts

-

100+ parts

$16.060

1k+ parts

$14.370

10k+ parts

$13.530

9,951

-

$16.060

$14.370

$13.530

Verical

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

$20.075

1k+ parts

$17.962

10k+ parts

$16.913

3,780

-

$20.075

$17.962

$16.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 8 parts In-Stock

1+ parts

$15.099

100+ parts

$15.854

1k+ parts

$14.948

10k+ parts

-

8

$15.099

$15.854

$14.948

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

$16.800

100+ parts

-

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10

$16.800

-

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Digiode

USA . 81 parts In-Stock

1+ parts

$19.352

100+ parts

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81

$19.352

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Vyrian

USA . 7,812 parts In-Stock

1+ parts

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7,812

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Flip Electronics

USA . 4,750 parts In-Stock

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4,750

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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500

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ABC Electronics Ltd.

UK . 31 parts In-Stock

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Microfarads

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Corohmni

South Africa . 400 parts In-Stock

1+ parts

$15.099

100+ parts

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400

$15.099

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Ampacity Inc.

Singapore . 1,770 parts In-Stock

1+ parts

$17.310

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1,770

$17.310

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Component Stockers USA

USA . 15,102 parts In-Stock

1+ parts

$18.140

100+ parts

$17.050

1k+ parts

$15.420

10k+ parts

-

15,102

$18.140

$17.050

$15.420

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Corphita

USA . 1,999 parts In-Stock

1+ parts

$18.333

100+ parts

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1,999

$18.333

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Kulean Microsystems

USA . 8,270 parts In-Stock

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8,270

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Problanco Electronics

Mexico . 5,026 parts In-Stock

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5,026

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Continental Prestige Electronics

USA . 4,262 parts In-Stock

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4,262

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Microchip USA

USA . 3,721 parts In-Stock

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3,721

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Perfect Parts

USA . 3,382 parts In-Stock

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Argo Parts USA

USA . 3,170 parts In-Stock

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3,170

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SupplyDigital Components

Austria . 1,802 parts In-Stock

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TANS Electronics

Latvia . 1,691 parts In-Stock

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1,691

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UHIMA Technologies

Türkiye . 474 parts In-Stock

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474

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GreenTree Electronics

Israel . 335 parts In-Stock

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335

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Authorized Procurement Solutions

USA . 235 parts In-Stock

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235

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock seamless voltage translation with the MC100EPT622FAG by Onsemi. As a leading manufacturer of innovative components, Onsemi delivers unrivaled quality and reliability in their products. The MC100EPT622FAG falls under the category of Voltage Level Translators, designed for various applications that require precise voltage conversion. With its advanced technology and industrial-grade performance, this product offers customers exceptional value, benefits, and advantages. Experience seamless compatibility and superior functionality with the MC100EPT622FAG from Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Ease of assembly and PCB space saving, ideal for compact designs.

Maximum Supply Voltage: 3.8 V

Wide supply voltage range suitable for various applications.

No. of Functions: 10

Versatile functionality for multiple signal translations.

Package Shape: SQUARE

Compact package shape for efficient PCB layout.

Power Supplies (V): 3.3

Operates at a standard power supply voltage, compatible with many systems.

No. of Terminals: 32

Sufficient terminals for connectivity and signal routing.

Package Style (Meter): FLATPACK, LOW PROFILE

Space-saving package style suitable for high-density board designs.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement for flexibility in power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for reliability in different environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme conditions.

Terminal Finish: MATTE TIN

Durable terminal finish for reliable connections.

Terminal Position: QUAD

Quad terminal position for easy integration and connection.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 7 mm

Compact width for efficient board space utilization.

Output Polarity: TRUE

Consistent output polarity for predictable signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow time for reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for robust soldering.

Length: 7 mm

Compact length for space-efficient design integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Technology: ECL

Utilizes ECL technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable soldering.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

Maximum Delay: 0.875 ns

Low maximum delay for fast signal translation.

Terminal Pitch: 0.8 mm

Compact terminal pitch for efficient PCB layout.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for storage and handling precautions.

Interface IC Type: LVTTL/LVCMOS TO LVECL TRANSLATOR

Suitable for translating signals between different logic levels efficiently.

Technical Specifications

Voltage Level Translators MC100EPT622FAG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.875 ns

JESD-30 Code:

S-XQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Bits:

1

No. of Functions:

10

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100EPT622FAG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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