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MC100EPT26DTG

Onsemi

MC100EPT26DTG by Onsemi

MC100EPT26DTG by Onsemi is a voltage level translator with 3.3V power supply, 2.2ns max delay, and PECL to TTL interface. Ideal for industrial applications requiring ECL technology, it operates b/w -40 to 85°C with a peak reflow temperature of 260°C. The compact package features dual terminals in a small outline design for surface mount assembly.

Median Price

$7.472

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 379 parts In-Stock

1+ parts

$7.870

100+ parts

$6.090

1k+ parts

$6.080

10k+ parts

-

379

$7.870

$6.090

$6.080

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DigiKey

USA . 527 parts In-Stock

1+ parts

$10.240

100+ parts

$6.819

1k+ parts

$6.202

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527

$10.240

$6.819

$6.202

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Chip1Stop

Japan . 70 parts In-Stock

1+ parts

$21.900

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70

$21.900

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Flip Electronics (Authorized)

USA . 7,400 parts In-Stock

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7,400

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Rochester

USA . 1,355 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

$5.070

10k+ parts

$4.770

1,355

-

$5.660

$5.070

$4.770

Verical

USA . 1,315 parts In-Stock

1+ parts

-

100+ parts

$7.075

1k+ parts

$6.338

10k+ parts

$5.963

1,315

-

$7.075

$6.338

$5.963

Arrow

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$6.783

1k+ parts

$6.026

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100

-

$6.783

$6.026

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.389

100+ parts

-

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50

$6.389

-

-

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Digiode

USA . 521 parts In-Stock

1+ parts

$8.280

100+ parts

-

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521

$8.280

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Vyrian

USA . 7,573 parts In-Stock

1+ parts

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7,573

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Flip Electronics

USA . 1,300 parts In-Stock

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1,300

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Speed Components Ltd

Israel . 391 parts In-Stock

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391

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Bristol Electronics

USA . 227 parts In-Stock

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227

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Tectiva GmbH

Germany . 20 parts In-Stock

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20

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J & M Industries LLC

USA . 19 parts In-Stock

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19

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Atlantic Semiconductor

USA . 5 parts In-Stock

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5

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North Shore Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.394

100+ parts

$2.179

1k+ parts

$1.963

10k+ parts

-

2,500

$2.394

$2.179

$1.963

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Semicontronic

India . 878 parts In-Stock

1+ parts

$3.980

100+ parts

$3.880

1k+ parts

$3.861

10k+ parts

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878

$3.980

$3.880

$3.861

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Ampacity Inc.

Singapore . 772 parts In-Stock

1+ parts

$3.980

100+ parts

-

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772

$3.980

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$4.680

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71

$4.680

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$6.261

100+ parts

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$6.011

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1,000

$6.261

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$6.011

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Aztec Data Supply Inc.

USA . 2,742 parts In-Stock

1+ parts

$7.154

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2,742

$7.154

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Component Stockers USA

USA . 1 parts In-Stock

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$7.200

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1

$7.200

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Corphita

USA . 250 parts In-Stock

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$7.844

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250

$7.844

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Continental Prestige Electronics

USA . 7 parts In-Stock

1+ parts

$9.830

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$6.600

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7

$9.830

$6.600

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Lixinc

USA . 17,950 parts In-Stock

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Microchip USA

USA . 10,157 parts In-Stock

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Kulean Microsystems

USA . 6,465 parts In-Stock

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Problanco Electronics

Mexico . 3,582 parts In-Stock

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TANS Electronics

Latvia . 3,071 parts In-Stock

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Perfect Parts

USA . 2,520 parts In-Stock

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SupplyDigital Components

Austria . 2,115 parts In-Stock

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Argo Parts USA

USA . 1,573 parts In-Stock

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Kepictronics

USA . 642 parts In-Stock

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642

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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264

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ChipTracer

USA . 227 parts In-Stock

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227

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Speed Components Ltd (Excess)

Israel . 74 parts In-Stock

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74

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GreenTree Electronics

Israel . 70 parts In-Stock

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70

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Authorized Procurement Solutions

USA . 70 parts In-Stock

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70

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Overview

Elevate your voltage level translation with the MC100EPT26DTG by Onsemi. Crafted with precision and reliability in mind, this voltage level translator boasts top-notch quality and performance. Ideal for a wide range of applications, this product offers seamless compatibility and efficient signal conversion. Experience the value of smooth signal transition and enhanced functionality with the MC100EPT26DTG. Trust in Onsemi's expertise and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

This feature makes the product easy to install and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of input voltages, increasing versatility.

Package Shape: SQUARE

The square shape of the package provides stability and ease of handling during installation.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common electronic devices.

No. of Terminals: 8

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design saves space on the PCB and facilitates efficient heat dissipation.

Minimum Supply Voltage: 3 V

Ensures proper operation even with lower input voltages.

Maximum Operating Temperature: 85 °C

Allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ensures the product can function in extreme cold temperatures.

Terminal Finish: MATTE TIN

Provides corrosion resistance and ensures a secure electrical connection.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout options.

Maximum Seated Height: 1.1 mm

Low profile design allows for compact packaging and space-saving.

Width: 3 mm

Compact width enables integration into tight spaces on the PCB.

Output Polarity: TRUE

Provides accurate signal translation without inversion.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the component during assembly.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes.

Length: 3 mm

Compact length for minimal footprint on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications requiring robust performance.

Technology: ECL

Emitter-coupled logic technology offers high-speed signal translation capabilities.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical and electrical connections.

Maximum Supply Current: 40 mA

Handles high current loads with ease.

Input Characteristics: DIFFERENTIAL

Supports differential input signals for reliable data communication.

Nominal Supply Voltage: 3.3 V

Compatible with standard voltage requirements for electronics.

Maximum Delay: 2.2 ns

Delivers fast signal translation without delays.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for dense PCB layouts.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage during storage and operation.

Interface IC Type: PECL TO TTL TRANSLATOR

Offers seamless translation between PECL and TTL signal levels.

Technical Specifications

Voltage Level Translators MC100EPT26DTG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EPT26DTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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