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LSF0108QWRKSRQ1

Texas Instruments

LSF0108QWRKSRQ1 by Texas Instruments

Texas Instruments' LSF0108QWRKSRQ1 is an 8-bit voltage level translator with a max supply voltage of 5V and AEC-Q100 screening. It features open-drain output characteristics, operates b/w -40 to 125 °C, and has a compact chip carrier package style. Ideal for applications requiring precise voltage translation in automotive electronics.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 150,581 parts In-Stock

1+ parts

$1.230

100+ parts

$1.016

1k+ parts

$0.549

10k+ parts

-

150,581

$1.230

$1.016

$0.549

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,388 parts In-Stock

1+ parts

$0.693

100+ parts

-

1k+ parts

-

10k+ parts

-

2,388

$0.693

-

-

-

Digiode

USA . 62 parts In-Stock

1+ parts

$1.168

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$1.168

-

-

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,766 parts In-Stock

1+ parts

$1.107

100+ parts

-

1k+ parts

-

10k+ parts

-

3,766

$1.107

-

-

-

Microchip USA

USA . 4,583 parts In-Stock

1+ parts

$4.962

100+ parts

-

1k+ parts

-

10k+ parts

-

4,583

$4.962

-

-

-

Overview

Enhance your electronic designs with the Texas Instruments LSF0108QWRKSRQ1 voltage level translator. As a trusted manufacturer in the industry, Texas Instruments delivers superior quality and reliability. This versatile chip carrier with open-drain output characteristics is ideal for a wide range of applications. From automotive to industrial electronics, this voltage level translator provides seamless communication between different voltage domains. Trust Texas Instruments to provide innovative solutions that elevate your projects to new heights of performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material ensures durability and light weight, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards.

Maximum Supply Voltage: 5 V

Can handle a maximum supply voltage of 5V, making it compatible with a wide range of systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, ideal for automotive applications.

No. of Bits: 8

8 bits allow for precise and accurate voltage level translation.

No. of Terminals: 20

With 20 terminals, it provides ample connectivity options for various circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and installation, catering to different space requirements.

Minimum Supply Voltage: 0 V

Supports a minimum supply voltage of 0V, ensuring compatibility with low power systems.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, suitable for industrial and automotive environments.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics provide flexibility in interfacing with different types of circuits.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Terminal finish ensures good conductivity and corrosion resistance for reliable performance.

Terminal Position: QUAD

Quad terminal position offers stability and ease of connection on the circuit board.

Maximum Seated Height: 1 mm

Low seated height allows for compact and space-efficient design implementations.

Width: 2.5 mm

Narrow width enables installation in tight spaces, saving valuable PCB real estate.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes, ensuring product reliability.

Length: 4.5 mm

Compact length facilitates easy integration into different electronic systems.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of short circuits and improves overall reliability.

Output Latch/Register: LATCH

Latching output feature provides stability and control in data transmission.

Nominal Supply Voltage: 1 V

Supports a nominal supply voltage of 1V, suitable for low-power and sensitive applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and compact design layouts.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Designed specifically for voltage level translation, ensuring accurate and reliable signal conversion.

Technical Specifications

Voltage Level Translators LSF0108QWRKSRQ1 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

LATCH

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.1X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

0 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.5 mm

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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