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SN65LVDS16DRFRG4

Texas Instruments

SN65LVDS16DRFRG4 by Texas Instruments

SN65LVDS16DRFRG4 by Texas Instruments is a voltage level translator with 2.5/3.3V power supplies, PECL to LVDS interface, and 0.63ns max delay. It is used in industrial applications for signal conversion b/w different logic levels efficiently and reliably.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,729 parts In-Stock

1+ parts

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4,729

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Vyrian

USA . 4,400 parts In-Stock

1+ parts

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4,400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$5.676

100+ parts

-

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613

$5.676

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Parana Technologies

USA . 1,295 parts In-Stock

1+ parts

$10.814

100+ parts

$1,004.280

1k+ parts

$9.733

10k+ parts

-

1,295

$10.814

$1,004.280

$9.733

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DigiPath Technology Company

USA . 665 parts In-Stock

1+ parts

$11.908

100+ parts

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665

$11.908

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ChromeModa Solutions

Germany . 1,484 parts In-Stock

1+ parts

$12.151

100+ parts

$9.964

1k+ parts

-

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1,484

$12.151

$9.964

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IDEA Electronic Components Group

UK . 857 parts In-Stock

1+ parts

$12.151

100+ parts

$11.543

1k+ parts

$10.936

10k+ parts

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857

$12.151

$11.543

$10.936

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One Stop Electronics

USA . 695 parts In-Stock

1+ parts

$49.500

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695

$49.500

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Corphita

USA . 3,324 parts In-Stock

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3,324

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Overview

Upgrade your voltage level translation needs with the SN65LVDS16DRFRG4 by Texas Instruments. Designed with precision and reliability in mind, this product offers seamless compatibility and superior performance for a wide range of applications. Whether you're working on industrial automation, telecommunications, or automotive systems, this voltage level translator is your go-to solution. With its advanced technology and high-quality construction, Texas Instruments ensures that you get the best value and benefits from this product. Trust the industry leader and experience the advantages of the SN65LVDS16DRFRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Surface Mount: YES

Surface mounting capability allows for easy integration and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage for versatile applications.

Minimum Supply Voltage: 2.375 V

Supports a low minimum supply voltage for flexibility in different power supply scenarios.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low temperatures, ensuring performance in harsh environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in connectivity options.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Technology: BICMOS

Utilizes BiCMOS technology for high-speed and low-power operation.

Interface IC Type: PECL TO LVDS TRANSLATOR

Specifically designed for translating signals between PECL and LVDS interfaces, ensuring seamless communication.

Technical Specifications

Voltage Level Translators SN65LVDS16DRFRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 V SUPPLY

Maximum Delay:

.63 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN65LVDS16DRFRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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