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NVT2006TL

NXP Semiconductors

NVT2006TL by NXP Semiconductors

NVT2006TL by NXP Semiconductors is a 6-bit voltage level translator with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. Its compact design features a dual terminal layout, ideal for GTL to TTL applications. This surface-mount device ensures efficient signal conversion in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,405 parts In-Stock

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Anansix

USA . 2,122 parts In-Stock

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Vyrian

USA . 882 parts In-Stock

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One Stop Electronics

USA . 1,632 parts In-Stock

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$36.500

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UNI Independent Distributors

Spain . 6,649 parts In-Stock

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Corphita

USA . 2,488 parts In-Stock

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Overview

Unlock seamless communication between devices with the NVT2006TL from NXP Semiconductors—a trusted name in innovation. This advanced voltage level translator excels in industrial applications, bridging 1V to 5.5V systems effortlessly. With its robust design and compact profile, it ensures reliability and performance even in demanding environments. Elevate your designs with enhanced signal integrity and efficiency, knowing you have the backing of a leader in semiconductor technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

The relatively low maximum supply voltage ensures compatibility with a wide range of low-voltage systems.

Package Shape: RECTANGULAR

Rectangular packaging facilitates efficient placement on PCBs, optimizing layout and enhancing circuit design flexibility.

No. of Bits: 6

With 6 bits, this device supports higher data throughput for applications requiring multiple signal translations.

Maximum Supply Voltage-1: 5.5 V

The versatile maximum supply voltage of 5.5 V allows operation in various logic-level environments.

No. of Terminals: 16

A 16-terminal configuration provides ample connections for multiple signals, enhancing its usability in complex designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small and thin profile is ideal for space-constrained applications, allowing for a compact board design.

Minimum Supply Voltage-1: 1.8 V

Allows for operation in low-power applications, making it efficient for battery-operated devices.

Minimum Supply Voltage: 1 V

Enables operation at very low voltage levels, ideal for modern low-power electronics.

Maximum Operating Temperature: 85 °C

This temperature range ensures reliability in various industrial applications.

Output Characteristics: OPEN-DRAIN

Open-drain outputs allow for easier interfacing with other devices and pull-up resistor configurations.

Minimum Operating Temperature: -40 °C

Designed to function in extreme cold environments, enhancing performance in rugged conditions.

Terminal Position: DUAL

Dual terminal positions facilitate easier and more flexible PCB design.

Maximum Seated Height: 0.5 mm

Minimal height supports low-profile designs crucial for slim and compact end products.

Width: 1.35 mm

Narrow width allows for high-density layout on printed circuit boards.

Output Polarity: TRUE

True output polarity supports straightforward integration in circuits requiring standard logic levels.

Length: 3.3 mm

Compact length helps maintain low space requirements without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability and durability in harsh environments.

Terminal Form: NO LEAD

No-lead terminals enhance thermal performance and reduce the potential for solder-related defects.

Maximum Delay: 0 ns

Zero maximum delay ensures fast signal translation, which is critical for high-speed applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for a higher number of connections in a smaller area, optimizing PCB design.

Interface IC Type: GTL TO TTL TRANSCEIVER

The device seamlessly converts between GTL and TTL logic levels, enhancing compatibility in mixed-signal environments.

Technical Specifications

Voltage Level Translators NVT2006TL attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-N16

Length:

3.3 mm

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.35 mm

Trade Compliance

NVT2006TL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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