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NVT2003DP

NXP Semiconductors

NVT2003DP by NXP Semiconductors

NVT2003DP by NXP Semiconductors is a 3-bit voltage level translator with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. Its compact SOIC package (3mm x 3mm) supports surface mounting, ideal for industrial applications. With open-emitter outputs, it ensures reliable signal integrity across different voltage levels.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Flip Electronics

USA . 52,103 parts In-Stock

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Digiode

USA . 2,373 parts In-Stock

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Anansix

USA . 2,178 parts In-Stock

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Vyrian

USA . 1,469 parts In-Stock

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One Stop Electronics

USA . 334 parts In-Stock

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$28.500

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UNI Independent Distributors

Spain . 5,260 parts In-Stock

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Corphita

USA . 3,586 parts In-Stock

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Overview

Unlock seamless connectivity with the NVT2003DP from NXP Semiconductors, a trusted leader in innovative solutions. This high-quality voltage level translator ensures reliable communication across diverse applications, enhancing your designs with superior performance and robustness. Its compact, thin-profile package fits effortlessly into any layout, while its industrial-grade temperature range guarantees reliability in challenging environments. Elevate your projects with the NVT2003DP—where quality meets versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for compact designs with enhanced integration into modern electronic circuits.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this translator can accommodate low-power applications effectively.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout and space optimization in designs.

No. of Bits: 3

The 3-bit capability allows for versatile applications, enabling multiple signal translations in one device.

Maximum Supply Voltage-1: 5.5 V

The extended maximum supply voltage of 5.5V supports a wider range of devices and increases design flexibility.

No. of Terminals: 10

Ten terminals offer extensive connectivity options for integration into complex circuitry.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile help save space and reduce weight in electronic designs.

Minimum Supply Voltage-1: 1.8 V

A minimum supply voltage of 1.8V ensures compatibility with low-voltage components, making it suitable for energy-efficient designs.

Minimum Supply Voltage: 1 V

The extremely low minimum supply voltage of 1V allows for operation in ultra-low power applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C enables reliable performance in industrial applications.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristic allows for easy interfacing with various logic levels and devices.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this device is suitable for extreme environments, ensuring reliability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB design and easier accessibility for soldering.

Maximum Seated Height: 1.1 mm

The low seated height helps in reducing overall profile in compact electronic assemblies.

Width: 3 mm

A width of 3mm enhances space efficiency on the PCB without compromising functionality.

Output Polarity: TRUE

The TRUE output polarity ensures consistent and predictable signal behavior.

Length: 3 mm

Its compact 3mm length is ideal for space-constrained applications, contributing to effective miniaturization.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this component is built for robustness and reliability in demanding settings.

Terminal Form: GULL WING

Gull wing terminals provide superior solder joint reliability and ease of handling during assembly.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm enables high-density designs, making it suitable for modern compact electronics.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

As a voltage level translator, this IC facilitates seamless communication between devices operating at different voltage levels.

Technical Specifications

Voltage Level Translators NVT2003DP attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Interface IC Type:

JESD-30 Code:

S-PDSO-G10

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NVT2003DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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