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MC10ELT24DR2

Onsemi

MC10ELT24DR2 by Onsemi

MC10ELT24DR2 by Onsemi is a voltage level translator with 8 terminals and ECL technology. It operates b/w -40 to 85 °C, translating TTL to ECL signals with a max delay of 2 ns. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$3.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,420 parts In-Stock

1+ parts

$3.000

100+ parts

$1.860

1k+ parts

$0.990

10k+ parts

-

2,420

$3.000

$1.860

$0.990

-

R&J Components

USA . 8,664 parts In-Stock

1+ parts

-

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8,664

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-

-

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Microfarads

USA . 2,287 parts In-Stock

1+ parts

-

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2,287

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-

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Vyrian

USA . 2,033 parts In-Stock

1+ parts

-

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2,033

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-

-

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Digiode

USA . 715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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715

-

-

-

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LIBRA Elektronik GmbH

Germany . 208 parts In-Stock

1+ parts

-

100+ parts

-

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208

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Sensible Micro Corp

USA . 179 parts In-Stock

1+ parts

-

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179

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Mentor Electronics Marketing, LLC

USA . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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67

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 87 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

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87

$0.936

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-

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Problanco Electronics

Mexico . 7,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,174

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Kulean Microsystems

USA . 6,986 parts In-Stock

1+ parts

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6,986

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TANS Electronics

Latvia . 4,516 parts In-Stock

1+ parts

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4,516

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SupplyDigital Components

Austria . 2,995 parts In-Stock

1+ parts

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2,995

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Corphita

USA . 1,224 parts In-Stock

1+ parts

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100+ parts

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1,224

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UHIMA Technologies

Türkiye . 110 parts In-Stock

1+ parts

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110

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Overview

Experience seamless voltage level translation with the MC10ELT24DR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products designed for efficiency and reliability. Ideal for a wide range of applications, this voltage level translator offers unmatched performance and precision. With its compact design and advanced technology, customers can trust in the value and benefits that the MC10ELT24DR2 brings to their projects. Upgrade your system with Onsemi and elevate your experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for housing the components

Surface Mount: YES

Allows for easy and efficient installation on circuit boards

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs for versatile applications

Package Shape: RECTANGULAR

Compact shape for efficient use of space on PCBs

Power Supplies (V): 5,-4.5/-5.2

Supports dual power supply inputs for flexibility in different systems

No. of Terminals: 8

Sufficient terminals for connections in a typical voltage translator

Package Style (Meter): SMALL OUTLINE

Space-saving design for densely populated circuit boards

Minimum Supply Voltage: 4.5 V

Can operate efficiently even at low voltage inputs

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments for reliable performance

Output Characteristics: OPEN-EMITTER

Provides flexibility in output configuration for diverse applications

Minimum Operating Temperature: -40 °C

Can operate in low temperature conditions without issues

Terminal Finish: TIN LEAD

Provides reliable electrical connections for long-term use

Terminal Position: DUAL

Facilitates connections with dual power supplies for compatibility

Maximum Seated Height: 1.75 mm

Low profile design for applications with height restrictions

Width: 3.9 mm

Compact width for efficient use of space on PCBs

Output Polarity: COMPLEMENTARY

Produces complementary output signals for effective signal conversion

Peak Reflow Temperature °C: 235

Can withstand high temperature reflow soldering processes during assembly

Length: 4.9 mm

Compact length for efficient use of space on PCBs

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding environmental conditions

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed operation

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs with gull wing terminals

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with common systems

Nominal Negative Supply Voltage: -5 V

Provides a negative supply voltage for proper signal translation

Maximum Delay: 2 ns

Low delay for efficient signal translation in high-speed applications

Terminal Pitch: 1.27 mm

Standard pitch for compatibility with common PCB layouts

Interface IC Type: TTL TO ECL TRANSLATOR

Specifically designed for translating signals between TTL and ECL logic levels

Technical Specifications

Voltage Level Translators MC10ELT24DR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-4.5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC10ELT24DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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