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MC100H603FNR2

Onsemi

MC100H603FNR2 by Onsemi

MC100H603FNR2 by Onsemi is a voltage level translator with 9 functions, operating b/w -4.5V to 5.5V. It features ECL technology, 12ns max delay, and ECL to TTL translation. Ideal for applications requiring precise signal conversion in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 689 parts In-Stock

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Kulean Microsystems

USA . 5,832 parts In-Stock

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Kepictronics

USA . 5,465 parts In-Stock

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Microchip USA

USA . 5,367 parts In-Stock

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Assy Fe

Spain . 4,965 parts In-Stock

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TANS Electronics

Latvia . 2,361 parts In-Stock

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Corphita

USA . 2,166 parts In-Stock

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Problanco Electronics

Mexico . 1,509 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 499 parts In-Stock

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SupplyDigital Components

Austria . 91 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the MC100H603FNR2 by Onsemi. Known for their cutting-edge technology and superior quality, Onsemi brings you a voltage level translator that offers seamless integration, reliable performance, and versatile applications. From ensuring smooth communication between different voltage domains to enhancing signal integrity, this product delivers unparalleled value and benefits to customers. Upgrade your projects with the MC100H603FNR2 and experience the difference in efficiency and effectiveness.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and labor.

Maximum Supply Voltage: 5.5 V

Can handle a relatively high supply voltage, providing flexibility in use.

No. of Functions: 9

Offers multiple functions in a single device, increasing efficiency and reducing cost.

Package Shape: SQUARE

Compact square shape fits well in tight spaces on circuit boards.

Power Supplies (V): 5,-4.5

Provides dual power supply options, giving flexibility in power configurations.

No. of Terminals: 28

Offers a large number of terminals for connecting to various components and interfaces.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is suitable for high-density mounting and thermal performance.

Minimum Supply Voltage: 4.5 V

Works efficiently even at lower supply voltages, conserving power.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, suitable for industrial and harsh environments.

Output Characteristics: 3-STATE

3-state outputs allow for multiple output states, increasing flexibility in signal control.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, suitable for a wide range of environments.

Terminal Finish: TIN LEAD

Tin-lead finish provides good solderability and reliability in connection.

Terminal Position: QUAD

Quad terminal position offers multiple connection points, enhancing versatility in installation.

Maximum Seated Height: 4.57 mm

Low seated height allows for compact design and efficient use of space on PCBs.

Width: 11.505 mm

Narrow width provides compatibility with standard PCB layouts and spacing requirements.

Output Polarity: COMPLEMENTARY

Complementary outputs provide balanced signal levels for efficient signal processing.

Peak Reflow Temperature °C: 235

Can withstand high-temperature reflow processes during manufacturing, ensuring proper assembly.

Length: 11.505 mm

Compact length fits well within limited space on circuit boards.

Technology: ECL

ECL technology offers high-speed operation and low power consumption for efficient signal translation.

Terminal Form: J BEND

J bend terminal form provides mechanical stability and ease of soldering during assembly.

Output Latch/Register: LATCH

Latching capability allows for temporary storage of output data, enhancing signal processing control.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance in various operating conditions.

Nominal Negative Supply Voltage: -4.5 V

Negative supply voltage option enables bidirectional signal translation capabilities.

Maximum Delay: 12 ns

Low maximum delay ensures fast signal response for real-time applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection to PCBs and external components.

Interface IC Type: ECL TO TTL TRANSLATOR

Specific interface type for translating signals between ECL and TTL logic levels, ensuring compatibility and seamless signal communication.

Technical Specifications

Voltage Level Translators MC100H603FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

12 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H603FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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