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MC10H605FN

Onsemi

MC10H605FN by Onsemi

MC10H605FN by Onsemi is a voltage level translator with 6 functions, operating b/w -5.2V to 5.5V. It features ECL technology, quad terminals, and true output polarity. Ideal for ECL to TTL translation applications due to its fast 6.7ns max delay and compact chip carrier package style.

Median Price

$13.826

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 237 parts In-Stock

1+ parts

-

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$12.290

1k+ parts

$11.000

10k+ parts

$10.350

237

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$12.290

$11.000

$10.350

Verical

USA . 237 parts In-Stock

1+ parts

-

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$15.363

1k+ parts

$13.750

10k+ parts

$12.938

237

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$15.363

$13.750

$12.938

Distributors (In-Stock)

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NAC Semi

USA . 55 parts In-Stock

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$5.550

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$5.550

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Digiode

USA . 2,370 parts In-Stock

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$13.006

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$13.006

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Vyrian

USA . 8,471 parts In-Stock

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A2Z Electronics, Inc.

USA . 1,328 parts In-Stock

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Prism Electronics

USA . 62 parts In-Stock

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North Shore Components

USA . 30 parts In-Stock

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Connector Distribution Corp

USA . 10 parts In-Stock

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10

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Right Parts Inc.

USA . 10 parts In-Stock

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10

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J & M Industries LLC

USA . 7 parts In-Stock

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Q Components

USA . 1 parts In-Stock

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Corohmni

South Africa . 170 parts In-Stock

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$12.030

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170

$12.030

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Corphita

USA . 621 parts In-Stock

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$12.321

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621

$12.321

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QUARKTWIN TECHNOLOGY LTD

USA . 24,115 parts In-Stock

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Problanco Electronics

Mexico . 6,845 parts In-Stock

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SupplyDigital Components

Austria . 6,100 parts In-Stock

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Kulean Microsystems

USA . 5,458 parts In-Stock

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TANS Electronics

Latvia . 3,412 parts In-Stock

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Metaverse IC Inc.

Canada . 1,462 parts In-Stock

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UHIMA Technologies

Türkiye . 753 parts In-Stock

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Continental Prestige Electronics

USA . 259 parts In-Stock

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Microchip USA

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Perfect Parts

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Kepictronics

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Experience superior quality and performance with the MC10H605FN voltage level translator by Onsemi. As a trusted manufacturer in the industry, Onsemi ensures reliability and innovation in their products. The MC10H605FN is perfect for a wide range of applications, offering seamless voltage translation with 6 functions in a convenient chip carrier package. Enjoy the benefits of enhanced functionality and efficiency with this cutting-edge technology, providing customers with exceptional value and unmatched advantages. Elevate your projects with the MC10H605FN and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to damage, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on a circuit board.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, offering flexibility in different circuit configurations.

No. of Functions: 6

Having multiple functions integrated into one component saves space and simplifies circuit design.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Power Supplies (V): -5.2

Supports negative supply voltage, enabling use in a wider range of applications.

No. of Terminals: 28

Having multiple terminals provides flexibility in connecting to other components in the circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection and ease of handling during assembly.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, ideal for demanding environments.

Minimum Operating Temperature: 0 °C

Can function in cold temperatures, ensuring performance in various conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for stable and secure mounting on the circuit board.

Maximum Seated Height: 4.57 mm

Low profile design saves space and allows for compact circuit layouts.

Width: 11.505 mm

Compact width size enables tight placement on the circuit board.

Output Polarity: TRUE

True output polarity ensures correct signal processing in the circuit.

Peak Reflow Temperature °C: 235

Withstands high reflow temperatures during assembly processes, ensuring product reliability.

Length: 11.505 mm

Compact length size saves space on the circuit board.

Technology: ECL

ECL technology offers high-speed performance and low power consumption for efficient operation.

Terminal Form: J BEND

J bend terminal form provides mechanical stability and ease of soldering during assembly.

Output Latch/Register: REGISTER

Output register ensures signal integrity and stability in data transmission.

Nominal Supply Voltage: 5 V

Nominal supply voltage compatibility with standard power sources simplifies circuit integration.

Nominal Negative Supply Voltage: -5.2 V

Support for negative supply voltage allows for flexibility in circuit design.

Maximum Delay: 6.7 ns

Low maximum delay ensures fast signal transmission for efficient operation.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy and secure connections on the circuit board.

Interface IC Type: ECL TO TTL TRANSLATOR

Specialized interface IC type for efficient translation between ECL and TTL signal levels.

Technical Specifications

Voltage Level Translators MC10H605FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6.7 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H605FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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