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MC10H602FNG

Onsemi

MC10H602FNG by Onsemi

MC10H602FNG by Onsemi is a voltage level translator with 28 terminals, operating at 5.5V max and -5.2V min. It features TTL to ECL translation, open-emitter output, and 3.2ns delay, suitable for commercial extended temperature applications in chip carrier package style.

Median Price

$7.852

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,952 parts In-Stock

1+ parts

-

100+ parts

$6.980

1k+ parts

$6.250

10k+ parts

$5.880

11,952

-

$6.980

$6.250

$5.880

Verical

USA . 11,877 parts In-Stock

1+ parts

-

100+ parts

$8.725

1k+ parts

$7.813

10k+ parts

$7.350

11,877

-

$8.725

$7.813

$7.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,793 parts In-Stock

1+ parts

$7.391

100+ parts

-

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-

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1,793

$7.391

-

-

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Vyrian

USA . 5,343 parts In-Stock

1+ parts

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5,343

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R&J Components

USA . 14 parts In-Stock

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14

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Distributors (Availability)

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Corphita

USA . 290 parts In-Stock

1+ parts

$7.002

100+ parts

-

1k+ parts

-

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290

$7.002

-

-

-

Corohmni

South Africa . 318 parts In-Stock

1+ parts

$7.780

100+ parts

-

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318

$7.780

-

-

-

AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$14.110

100+ parts

-

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613

$14.110

-

-

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TANS Electronics

Latvia . 5,303 parts In-Stock

1+ parts

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5,303

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Problanco Electronics

Mexico . 3,230 parts In-Stock

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Kulean Microsystems

USA . 2,491 parts In-Stock

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2,491

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 941 parts In-Stock

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941

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Microchip USA

USA . 415 parts In-Stock

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415

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SupplyDigital Components

Austria . 70 parts In-Stock

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70

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Perfect Parts

USA . 28 parts In-Stock

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28

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Overview

Discover the innovative MC10H602FNG by Onsemi, a voltage level translator that delivers exceptional quality and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this product is designed to exceed expectations. Ideal for a wide range of applications, this voltage level translator offers customers unparalleled value and benefits. Say goodbye to compatibility issues and hello to seamless performance with the MC10H602FNG. Experience the advantages firsthand and elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the package, making it suitable for various environmental conditions.

Maximum Supply Voltage : 5.5 V

Higher maximum supply voltage allows for compatibility with a wide range of systems and applications.

No. of Terminals : 28

Having a large number of terminals enables versatile connectivity options and potential for complex circuit designs.

Minimum Operating Temperature : 0 °C

Can operate effectively at low temperatures, ensuring reliability in different environments.

Maximum Delay : 3.2 ns

Low delay time ensures fast signal transmission, making this voltage level translator suitable for high-speed applications.

Technical Specifications

Voltage Level Translators MC10H602FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H602FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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