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MC10H603FNR2

Onsemi

MC10H603FNR2 by Onsemi

MC10H603FNR2 by Onsemi is a voltage level translator with 9 functions, operating at 4.5-5.5V. It features ECL technology, 12ns max delay, and ECL to TTL translation capability. Ideal for applications requiring precise signal conversion in compact spaces.

Median Price

$7.280

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$7.280

1k+ parts

-

10k+ parts

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500

-

$7.280

-

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Rochester

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$6.280

1k+ parts

$5.620

10k+ parts

$5.290

360

-

$6.280

$5.620

$5.290

Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.025

10k+ parts

$6.612

360

-

$7.850

$7.025

$6.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,763 parts In-Stock

1+ parts

$6.150

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1,763

$6.150

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Digiode

USA . 1,287 parts In-Stock

1+ parts

$6.650

100+ parts

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1,287

$6.650

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Bristol Electronics

USA . 484 parts In-Stock

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484

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Atlantic Semiconductor

USA . 484 parts In-Stock

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484

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Distributors (Availability)

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Corohmni

South Africa . 443 parts In-Stock

1+ parts

$6.150

100+ parts

-

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443

$6.150

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Corphita

USA . 265 parts In-Stock

1+ parts

$6.300

100+ parts

-

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265

$6.300

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QUARKTWIN TECHNOLOGY LTD

USA . 14,683 parts In-Stock

1+ parts

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14,683

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SupplyDigital Components

Austria . 6,994 parts In-Stock

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6,994

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Problanco Electronics

Mexico . 5,617 parts In-Stock

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5,617

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Kulean Microsystems

USA . 4,727 parts In-Stock

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4,727

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Continental Prestige Electronics

USA . 500 parts In-Stock

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100+ parts

$6.200

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500

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$6.200

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Kepictronics

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 132 parts In-Stock

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132

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TANS Electronics

Latvia . 100 parts In-Stock

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100

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UHIMA Technologies

Türkiye . 90 parts In-Stock

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90

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Upgrade your voltage level translation with the MC10H603FNR2 by Onsemi, a top-quality solution for seamless signal conversion. Onsemi's reputation for excellence guarantees reliability and performance. This versatile chip carrier is perfect for a range of applications, offering a nominal supply voltage of 5V and a maximum delay of just 12ns. Experience the value of efficient signal processing and smooth functionality with the MC10H603FNR2 - the ultimate choice for your voltage translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product will have a long lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it versatile for a variety of applications.

No. of Functions: 9

With multiple functions, this product offers flexibility and can handle complex tasks efficiently.

Package Shape: SQUARE

The square shape allows for easy placement and alignment on the circuit board.

Minimum Supply Voltage: 4.5 V

Can operate at lower voltages, providing energy efficiency and saving power.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliability in various environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for flexibility in controlling the output signal, adding versatility to the product.

Technology: ECL

ECL technology ensures high-speed performance and precision in voltage translation, making it suitable for demanding applications.

Technical Specifications

Voltage Level Translators MC10H603FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

12 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H603FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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