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MC10EPT20DR2G

Onsemi

MC10EPT20DR2G by Onsemi

MC10EPT20DR2G by Onsemi is a voltage level translator with 3.3V power supply, 1.27mm terminal pitch, and 0.45ns max delay. It is used as a TTL/CMOS to PECL translator in industrial applications due to its ECL technology and operating temperature range of -40 °C to 85°C.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,251 parts In-Stock

1+ parts

-

100+ parts

$3.370

1k+ parts

$3.020

10k+ parts

$2.840

14,251

-

$3.370

$3.020

$2.840

DigiKey

USA . 14,251 parts In-Stock

1+ parts

-

100+ parts

$3.680

1k+ parts

-

10k+ parts

-

14,251

-

$3.680

-

-

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$4.213

1k+ parts

$3.775

10k+ parts

-

7,500

-

$4.213

$3.775

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,900 parts In-Stock

1+ parts

$3.562

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

$3.562

-

-

-

Vyrian

USA . 720 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

720

$3.750

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,683 parts In-Stock

1+ parts

$3.375

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$3.375

-

-

-

Corohmni

South Africa . 385 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$3.750

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$5.234

100+ parts

$5.182

1k+ parts

$4.972

10k+ parts

-

3,000

$5.234

$5.182

$4.972

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,675

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

SupplyDigital Components

Austria . 4,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,406

-

-

-

-

TANS Electronics

Latvia . 4,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,247

-

-

-

-

Kulean Microsystems

USA . 3,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,458

-

-

-

-

Problanco Electronics

Mexico . 2,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,755

-

-

-

-

Kepictronics

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,040

-

-

-

-

UHIMA Technologies

Türkiye . 818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

818

-

-

-

-

Microchip USA

USA . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

275

-

-

-

-

Overview

Discover the seamless voltage translation capabilities of the MC10EPT20DR2G by Onsemi, a leading manufacturer known for its high-quality components. Ideal for various applications, this voltage level translator offers unmatched reliability and efficiency, providing customers with a valuable solution for their projects. With fast signal transmission and precise performance, this product is a game-changer in the industry. Upgrade your designs with the MC10EPT20DR2G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the voltage level translator.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance of 3.6V ensures compatibility with a wide range of electronics and applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and allows for efficient use of space on a circuit board.

Power Supplies (V): 3.3

The 3.3V power supply ensures reliable and consistent operation of the voltage level translator.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and allows for versatile integration with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is suitable for compact electronic devices.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, this voltage level translator can operate effectively even with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for use in cold temperature environments without compromising functionality.

Terminal Finish: TIN

The terminal finish of TIN provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout and ensures secure connections.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm helps in maintaining a compact overall profile of the device.

Width: 3.9 mm

The slim width of 3.9 mm enables the voltage level translator to fit into tight spaces on the circuit board.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures accurate signal translation between different voltage levels.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature allows for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures proper soldering and connection of the voltage level translator on the circuit board.

Length: 4.9 mm

The compact length of 4.9 mm contributes to the overall small footprint of the voltage level translator.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures stable performance in demanding industrial environments.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology provides high-speed and reliable signal transmission for efficient voltage level translation.

Terminal Form: GULL WING

The gull wing terminal form offers easy soldering and secure connections to the circuit board.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power delivery for the voltage level translator.

Maximum Delay: 0.45 ns

The low maximum delay of 0.45 ns ensures fast signal translation and minimal latency in the voltage level conversion process.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy connection to standard pitch circuit boards and ensures compatibility with various systems.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

The interface IC type of TTL/CMOS to PECL translator enables seamless conversion between different signal standards, expanding the compatibility of the voltage level translator.

Technical Specifications

Voltage Level Translators MC10EPT20DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.45 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EPT20DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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