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SN65LVP17DRFRG4

Texas Instruments

SN65LVP17DRFRG4 by Texas Instruments

SN65LVP17DRFRG4 by Texas Instruments is a voltage level translator with 2.5/3.3V power supplies, PECL to LVDS interface, and 0.63ns max delay. It is used in industrial applications for translating signals b/w different voltage levels efficiently and accurately.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,770 parts In-Stock

1+ parts

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4,770

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Vyrian

USA . 3,182 parts In-Stock

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3,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$5.960

100+ parts

-

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417

$5.960

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Parana Technologies

USA . 338 parts In-Stock

1+ parts

$8.793

100+ parts

-

1k+ parts

$9.477

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338

$8.793

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$9.477

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DigiPath Technology Company

USA . 1,445 parts In-Stock

1+ parts

$9.682

100+ parts

$8.908

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1,445

$9.682

$8.908

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ChromeModa Solutions

Germany . 4,487 parts In-Stock

1+ parts

$9.880

100+ parts

$8.102

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4,487

$9.880

$8.102

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IDEA Electronic Components Group

UK . 1,967 parts In-Stock

1+ parts

$9.880

100+ parts

$9.386

1k+ parts

$8.892

10k+ parts

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1,967

$9.880

$9.386

$8.892

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One Stop Electronics

USA . 558 parts In-Stock

1+ parts

$44.500

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558

$44.500

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Corphita

USA . 4,764 parts In-Stock

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4,764

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Microchip USA

USA . 457 parts In-Stock

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457

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Overview

Discover the innovative SN65LVP17DRFRG4 by Texas Instruments, a top-quality voltage level translator designed for various applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled performance and reliability. Ideal for industrial use, this PECL to LVDS translator ensures seamless communication between different voltage levels. Trust in Texas Instruments to provide cutting-edge technology that meets your needs with precision and efficiency. Elevate your projects with the SN65LVP17DRFRG4 and experience the difference of superior quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Can handle high voltage applications, providing flexibility and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit designs and efficient use of space on the PCB.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, ensuring compatibility with various voltage configurations in electronic systems.

No. of Terminals: 8

With 8 terminals, this product offers flexibility in connecting to other components and devices in the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and heat sink features provide efficient heat dissipation and space-saving benefits in compact electronic designs.

Minimum Supply Voltage: 2.375 V

Can operate at low supply voltages, making it suitable for power-sensitive applications and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliable performance in harsh environments or industrial applications.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product is suitable for use in extreme cold conditions without compromising performance.

Terminal Position: DUAL

Dual terminal position allows for easy connection and compatibility with various circuit layouts and configurations.

Maximum Seated Height: 0.8 mm

Low seated height makes it suitable for applications with space constraints or where a slim profile is required.

Width: 2 mm

Compact width ensures efficient use of space on the PCB, ideal for densely populated circuit designs.

Output Polarity: COMPLEMENTARY

Complementary output polarity enables easy integration with other components and ensures proper signal transmission in the circuit.

Length: 2 mm

Compact length contributes to a small overall footprint on the PCB, saving space and allowing for more components to be included in the design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in challenging environments with fluctuating temperatures.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the PCB assembly process and minimizes potential soldering issues, ensuring reliable connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage simplifies circuit design and ensures consistent performance in the specified voltage range.

Maximum Delay: 0.63 ns

Low maximum delay ensures fast signal transmission and minimal latency, critical for high-speed applications.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for high-density packing of components on the PCB, optimizing space usage in electronic designs.

Interface IC Type: PECL TO LVDS TRANSLATOR

Supports the translation of signals between PECL and LVDS interfaces, enabling compatibility and communication between different signal standards.

Technical Specifications

Voltage Level Translators SN65LVP17DRFRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 V SUPPLY

Maximum Delay:

.63 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

SN65LVP17DRFRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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