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TXB0101DRLRG4

Texas Instruments

TXB0101DRLRG4 by Texas Instruments

TXB0101DRLRG4 by Texas Instruments is a voltage level translator with 6 terminals, operating b/w -40 to 85 °C. It supports supply voltages of 1.2/3.6V and 1.8/5V, with a small outline package style suitable for industrial applications requiring precise voltage translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,415 parts In-Stock

1+ parts

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5,415

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Digiode

USA . 2,497 parts In-Stock

1+ parts

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100+ parts

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2,497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 280 parts In-Stock

1+ parts

$3.588

100+ parts

-

1k+ parts

$4.107

10k+ parts

-

280

$3.588

-

$4.107

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IDEA Electronic Components Group

UK . 1,971 parts In-Stock

1+ parts

$4.032

100+ parts

-

1k+ parts

$3.629

10k+ parts

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1,971

$4.032

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$3.629

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ChromeModa Solutions

Germany . 382 parts In-Stock

1+ parts

$4.032

100+ parts

$3.306

1k+ parts

-

10k+ parts

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382

$4.032

$3.306

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$19.134

100+ parts

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448

$19.134

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One Stop Electronics

USA . 1,049 parts In-Stock

1+ parts

$41.500

100+ parts

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1,049

$41.500

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Corphita

USA . 4,713 parts In-Stock

1+ parts

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4,713

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DigiPath Technology Company

USA . 1,925 parts In-Stock

1+ parts

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100+ parts

$3.635

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1,925

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$3.635

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Overview

Discover the superior quality and precision engineering of the TXB0101DRLRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers voltage level translators that are versatile and reliable. This product is perfect for applications where seamless communication between different voltage domains is crucial. With its compact design and advanced features, the TXB0101DRLRG4 offers customers unmatched value and performance. Upgrade your projects today with this cutting-edge voltage level translator from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and making installation more convenient.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Optimal shape for fitting into compact spaces on circuit boards.

Power Supplies (V): 1.2/3.6, 1.8/5

Ability to handle various power supply voltages, making it adaptable to different systems.

No. of Terminals: 6

Provides multiple connection points for interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Ideal for space-constrained applications where size and profile are important considerations.

Minimum Supply Voltage: 1.2 V

Can operate at low supply voltage levels, suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, enhancing its reliability.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, ensuring functionality in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections for long-term performance.

Terminal Position: DUAL

Offers multiple terminal positions for flexibility in circuit board layout and connection options.

Maximum Seated Height: 0.6 mm

Low profile design for compact applications and PCB space savings.

Width: 1.2 mm

Narrow width for efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during PCB assembly process, reducing manufacturing errors.

Peak Reflow Temperature °C: 260

High reflow temperature capability for reliable solder joints during assembly.

Length: 1.6 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand challenging industrial environments with temperature variations.

Terminal Form: FLAT

Flat terminal design for secure electrical connections.

Maximum Supply Current: 0.005 mA

Low supply current for energy-efficient operation and minimal power consumption.

Output Latch/Register: LATCH

Latching output for signal integrity and stability in data transmission.

Nominal Supply Voltage: 1.5 V

Standard supply voltage for compatibility with a wide range of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections on the circuit board.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Specifically designed for translating voltage levels between different components, ensuring proper signal transmission.

Technical Specifications

Voltage Level Translators TXB0101DRLRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

LATCH

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.005 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

TXB0101DRLRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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