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TXB0101DRLTG4

Texas Instruments

TXB0101DRLTG4 by Texas Instruments

TXB0101DRLTG4 by Texas Instruments is a voltage level translator with max supply voltage of 3.6V, min supply voltage of 1.2V, and operating temp range from -40 to 85°C. It has 6 terminals in a small outline package style for industrial applications requiring precise signal translation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,303 parts In-Stock

1+ parts

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3,303

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Digiode

USA . 1,095 parts In-Stock

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1,095

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,301 parts In-Stock

1+ parts

$9.478

100+ parts

-

1k+ parts

$10.087

10k+ parts

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2,301

$9.478

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$10.087

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ChromeModa Solutions

Germany . 1,820 parts In-Stock

1+ parts

$10.650

100+ parts

$8.733

1k+ parts

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1,820

$10.650

$8.733

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IDEA Electronic Components Group

UK . 471 parts In-Stock

1+ parts

$10.650

100+ parts

$10.118

1k+ parts

$9.585

10k+ parts

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471

$10.650

$10.118

$9.585

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AZTECH Wire

Italy . 782 parts In-Stock

1+ parts

$12.682

100+ parts

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782

$12.682

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One Stop Electronics

USA . 437 parts In-Stock

1+ parts

$42.500

100+ parts

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437

$42.500

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Corphita

USA . 3,920 parts In-Stock

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3,920

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DigiPath Technology Company

USA . 2,107 parts In-Stock

1+ parts

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100+ parts

$9.602

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2,107

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$9.602

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Overview

Elevate your electronics projects with the TXB0101DRLTG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality voltage level translators that are perfect for a wide range of applications. This versatile component offers seamless voltage translation and reliable performance, ensuring smooth operation for your devices. Trust in the value and benefits that Texas Instruments brings to the table with the TXB0101DRLTG4, and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The ability to be surface mounted makes the installation process easier and more efficient, saving time and effort.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows the product to be used with a wide range of circuits and devices.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, making it ideal for applications with limited space.

Power Supplies (V): 1.2/3.6,1.8/5

The ability to support multiple power supply voltages makes the product versatile and compatible with a variety of systems.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting the product to other components in the system.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile design make the product suitable for compact electronic devices and PCB layouts.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage allows the product to operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting the product to different devices or circuits.

Maximum Seated Height: 0.6 mm

The low maximum seated height contributes to a compact overall design, suitable for slim electronic devices.

Width: 1.2 mm

The narrow width of the product allows for efficient use of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering even in high-temperature reflow processes.

Length: 1.6 mm

The compact length of the product helps in conserving space on the PCB and facilitates a tidy layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand demanding operating conditions in industrial environments.

Terminal Form: FLAT

The flat terminal form provides stability and ease of connection during installation.

Maximum Supply Current: 0.005 mA

The low maximum supply current requirement indicates low power consumption, making the product energy-efficient.

Output Latch/Register: LATCH

The output latch/register feature helps in retaining the output state, ensuring stable operation in dynamic signal environments.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V provides compatibility with various systems and ensures consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch enables fine-pitch connections, enhancing the product's compatibility with modern electronic devices.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Being a voltage level translator, the product facilitates communication between devices with different voltage levels, enhancing interoperability.

Technical Specifications

Voltage Level Translators TXB0101DRLTG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

LATCH

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.005 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

TXB0101DRLTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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