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TXB0104PWRPWR

Texas Instruments

TXB0104PWRPWR by Texas Instruments

TXB0104PWRPWR by Texas Instruments is a voltage level translator with 4 bits, operating b/w -40 to 85 °C. It supports supply voltages of 1.2/3.6V and 1.8/5V, making it ideal for industrial applications requiring open-drain output characteristics in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,250 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,250

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Digiode

USA . 3,939 parts In-Stock

1+ parts

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100+ parts

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3,939

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,514 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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1,514

$0.500

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Parana Technologies

USA . 1,543 parts In-Stock

1+ parts

$2.381

100+ parts

-

1k+ parts

$2.878

10k+ parts

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1,543

$2.381

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$2.878

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ChromeModa Solutions

Germany . 2,542 parts In-Stock

1+ parts

$2.675

100+ parts

$2.194

1k+ parts

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10k+ parts

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2,542

$2.675

$2.194

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IDEA Electronic Components Group

UK . 558 parts In-Stock

1+ parts

$2.675

100+ parts

-

1k+ parts

$2.408

10k+ parts

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558

$2.675

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$2.408

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$5.322

100+ parts

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246

$5.322

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Corphita

USA . 4,107 parts In-Stock

1+ parts

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4,107

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DigiPath Technology Company

USA . 1,007 parts In-Stock

1+ parts

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100+ parts

$2.412

1k+ parts

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1,007

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$2.412

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Overview

Enhance your electronic designs with the TXB0104PWRPWR voltage level translator by Texas Instruments. Known for their high-quality components, Texas Instruments provides reliable solutions for a variety of applications. This voltage level translator offers seamless compatibility between different voltage levels, ensuring smooth communication within your circuit. With a compact design and industrial-grade temperature range, this product is a must-have for your projects. Experience improved performance and efficiency with the TXB0104PWRPWR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board.

No. of Bits: 4

4 bits allow for accurate and precise voltage level translation.

Power Supplies (V): 1.2/3.6,1.8/5

Supports multiple power supply voltage combinations, providing flexibility in design.

No. of Terminals: 14

14 terminals offer versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch saves space on the circuit board.

Minimum Supply Voltage: 1.2 V

Support for a minimum supply voltage of 1.2V ensures compatibility with lower power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable performance in various operating conditions.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics provide flexibility and compatibility with different circuit configurations.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in extreme temperature environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and increased reliability in connection.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2mm allows for compact integration into electronic devices.

Width: 4.4 mm

Narrow width of 4.4mm enables space-saving installation on the circuit board.

Length: 5 mm

Short length of 5mm helps in optimizing board space and layout design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections.

Maximum Supply Current: 0.005 mA

Low maximum supply current consumption of 0.005mA helps in saving power and reducing energy costs.

Output Latch/Register: LATCH

Latching output feature ensures data integrity and stability in signal transmission.

Nominal Supply Voltage: 1.5 V

Nominal supply voltage of 1.5V provides a standard reference point for voltage levels in the system.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65mm allows for high-density mounting on the circuit board.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Specifically designed as a voltage level translator, ensuring accurate and reliable voltage translation between different components.

Technical Specifications

Voltage Level Translators TXB0104PWRPWR attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

LATCH

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.005 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TXB0104PWRPWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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