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MC100EP91MNR2G

Onsemi

MC100EP91MNR2G by Onsemi

MC100EP91MNR2G by Onsemi is a voltage level translator with 3 functions, operating at -40 to 85 °C. It has a max delay of 0.75 ns and interfaces as an ECL to PECL translator. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$12.622

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,559 parts In-Stock

1+ parts

-

100+ parts

$11.220

1k+ parts

$10.040

10k+ parts

$9.450

13,559

-

$11.220

$10.040

$9.450

Verical

USA . 8,281 parts In-Stock

1+ parts

-

100+ parts

$14.025

1k+ parts

$12.550

10k+ parts

$11.813

8,281

-

$14.025

$12.550

$11.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,059 parts In-Stock

1+ parts

$11.875

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$11.875

-

-

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Vyrian

USA . 7,346 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,346

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-

-

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LIBRA Elektronik GmbH

Germany . 1,142 parts In-Stock

1+ parts

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1,142

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-

-

Distributors (Availability)

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Corphita

USA . 307 parts In-Stock

1+ parts

$11.250

100+ parts

-

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-

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-

307

$11.250

-

-

-

Corohmni

South Africa . 275 parts In-Stock

1+ parts

$12.500

100+ parts

-

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-

10k+ parts

-

275

$12.500

-

-

-

Component Stockers USA

USA . 14,235 parts In-Stock

1+ parts

$12.740

100+ parts

$11.970

1k+ parts

$10.830

10k+ parts

$10.830

14,235

$12.740

$11.970

$10.830

$10.830

AZTECH Wire

Italy . 807 parts In-Stock

1+ parts

$14.590

100+ parts

-

1k+ parts

-

10k+ parts

-

807

$14.590

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,553 parts In-Stock

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11,553

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Perfect Parts

USA . 8,277 parts In-Stock

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8,277

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TANS Electronics

Latvia . 7,168 parts In-Stock

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7,168

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SupplyDigital Components

Austria . 6,841 parts In-Stock

1+ parts

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6,841

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Problanco Electronics

Mexico . 5,233 parts In-Stock

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5,233

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Kulean Microsystems

USA . 3,301 parts In-Stock

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3,301

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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GreenTree Electronics

Israel . 1,158 parts In-Stock

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1,158

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Microchip USA

USA . 433 parts In-Stock

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433

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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163

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Overview

Unlock seamless voltage level translation with the MC100EP91MNR2G by Onsemi. This high-quality voltage level translator offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile chip carrier with a compact square package shape delivers efficient signal conversion with minimal delay. Trust Onsemi to provide cutting-edge solutions that elevate your designs to new heights. Experience the difference with the MC100EP91MNR2G today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.8 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input signals without risking damage.

No. of Functions: 3

Having multiple functions in one device increases versatility and flexibility in circuit design.

Package Shape: SQUARE

The square package shape allows for uniform mounting and secure placement within the circuit board layout.

Power Supplies (V): 2.5/3.3,-3.3/-5

Supporting multiple power supply voltages enhances compatibility with different systems and configurations.

No. of Terminals: 24

Having a high number of terminals enables connections to various components, supporting complex circuitry.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles provide options for different installation and cooling requirements, ensuring optimal performance and reliability.

Minimum Supply Voltage: 2.375 V

With a low minimum supply voltage, this voltage level translator can handle lower power signals efficiently.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments without sacrificing performance.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring stable connections over time.

Terminal Position: QUAD

Quad terminal position distributes connections evenly, promoting stable signal transmission and reducing signal interference.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and space-saving installation, ideal for applications with limited space.

Width: 4 mm

The moderate width of the device allows for easy integration into circuit board layouts while also providing sufficient space for connections.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate signal translation and compatibility with different logic systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during manufacturing processes, ensuring durable connections.

Length: 4 mm

The compact length of the device contributes to space efficiency in circuit board designs, especially in tight layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees reliability and performance in harsh operating conditions commonly found in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and improves overall reliability in high-stress environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a stable operating point for the device, ensuring consistent performance over a range of input signals.

Maximum Delay: 0.75 ns

The minimal delay in signal translation ensures fast and efficient processing of input signals, critical for high-speed applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for precise connections and efficient signal transmission, enhancing overall circuit performance.

Interface IC Type: ECL TO PECL TRANSLATOR

Supporting ECL to PECL translation, this device enables seamless communication between different logic systems, expanding its usability in various applications.

Technical Specifications

Voltage Level Translators MC100EP91MNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.75 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,-3.3/-5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

MC100EP91MNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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