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SN100KT5562DW

Texas Instruments

SN100KT5562DW by Texas Instruments

SN100KT5562DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. Operating temperature ranges from 0°C to 85°C, with output characteristics in 3-state. It is used as a TTL to ECL transceiver interface IC for various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,986 parts In-Stock

1+ parts

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7,986

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Digiode

USA . 1,973 parts In-Stock

1+ parts

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1,973

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$3.934

100+ parts

-

1k+ parts

$4.406

10k+ parts

-

2,251

$3.934

-

$4.406

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DigiPath Technology Company

USA . 1,660 parts In-Stock

1+ parts

$4.332

100+ parts

$3.985

1k+ parts

-

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1,660

$4.332

$3.985

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ChromeModa Solutions

Germany . 5,980 parts In-Stock

1+ parts

$4.420

100+ parts

$3.624

1k+ parts

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5,980

$4.420

$3.624

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

$3.978

10k+ parts

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1,814

$4.420

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$3.978

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One Stop Electronics

USA . 469 parts In-Stock

1+ parts

$7.500

100+ parts

-

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469

$7.500

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AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$18.219

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235

$18.219

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Corphita

USA . 1,004 parts In-Stock

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1,004

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Overview

Enhance your electronic projects with the SN100KT5562DW from Texas Instruments, a top-tier manufacturer known for its quality and reliability. This voltage level translator offers seamless communication between different voltage systems, making it ideal for a wide range of applications. With its compact design, advanced technology, and high-performance output characteristics, this product ensures optimal functionality and efficiency. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Upgrade your projects today with the SN100KT5562DW and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the voltage level translator.

Surface Mount: YES

Surface mount capability makes it easy to integrate the voltage level translator onto PCBs, saving space and enhancing flexibility in design.

No. of Functions: 8

Having 8 functions allows the voltage level translator to perform multiple tasks efficiently, making it versatile for various applications.

Package Shape: RECTANGULAR

Rectangular package shape helps in easy placement and alignment on PCBs, optimizing space usage.

No. of Terminals: 24

With 24 terminals, the voltage level translator can accommodate a wide range of input and output connections, making it suitable for complex circuits.

Maximum Operating Temperature: 85 °C

Operating at up to 85°C ensures stable performance even under high temperature environments.

Output Characteristics: 3-STATE

3-STATE output allows the voltage level translator to switch between high impedance and active states, enabling flexibility in signal routing.

Minimum Operating Temperature: 0 °C

Operating at 0°C ensures reliable performance even in low temperature conditions.

Terminal Position: DUAL

Dual terminal position provides better stability and connection reliability, reducing the risk of signal loss or interference.

Maximum Seated Height: 2.65 mm

Low seated height of 2.65mm allows for compact designs and efficient use of vertical space in electronics assemblies.

Width: 7.5 mm

Narrow width of 7.5mm saves space on the PCB, enabling more components to be placed without sacrificing performance.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without any inversion or distortion, maintaining data integrity.

Length: 15.4 mm

Compact length of 15.4mm makes the voltage level translator suitable for applications where space is limited but performance is critical.

Technology: ECL

Employing ECL technology ensures high-speed signal processing and low power consumption, making the voltage level translator efficient and fast.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure mechanical connection to the PCB, enhancing overall reliability of the product.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm allows for close placement of terminals, enabling high-density connections and reducing signal interference.

Interface IC Type: TTL TO ECL TRANSCEIVER

This interface IC type enables seamless communication between TTL and ECL devices, making the voltage level translator compatible with a wide range of systems.

Technical Specifications

Voltage Level Translators SN100KT5562DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5562DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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